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GET /api/patches/806998/?format=api
{ "id": 806998, "url": "http://patchwork.ozlabs.org/api/patches/806998/?format=api", "web_url": "http://patchwork.ozlabs.org/project/devicetree-bindings/patch/1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com/", "project": { "id": 37, "url": "http://patchwork.ozlabs.org/api/projects/37/?format=api", "name": "Devicetree Bindings", "link_name": "devicetree-bindings", "list_id": "devicetree.vger.kernel.org", "list_email": "devicetree@vger.kernel.org", "web_url": "", "scm_url": "", "webscm_url": "", "list_archive_url": "", "list_archive_url_format": "", "commit_url_format": "" }, "msgid": "<1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com>", "list_archive_url": null, "date": "2017-08-29T08:17:44", "name": "[v4,1/3] dt-bindings: Document the hi3660 thermal sensor bindings", "commit_ref": null, "pull_url": null, "state": "changes-requested", "archived": true, "hash": "36227f98611886b0fe39f807ed730224b17b1395", "submitter": { "id": 71830, "url": "http://patchwork.ozlabs.org/api/people/71830/?format=api", "name": "Wangtao (Kevin, Kirin)", "email": "kevin.wangtao@hisilicon.com" }, "delegate": null, "mbox": "http://patchwork.ozlabs.org/project/devicetree-bindings/patch/1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com/mbox/", "series": [ { "id": 324, "url": "http://patchwork.ozlabs.org/api/series/324/?format=api", "web_url": "http://patchwork.ozlabs.org/project/devicetree-bindings/list/?series=324", "date": "2017-08-29T08:17:43", "name": "thermal: add thermal sensor driver for Hi3660", "version": 4, "mbox": "http://patchwork.ozlabs.org/series/324/mbox/" } ], "comments": "http://patchwork.ozlabs.org/api/patches/806998/comments/", "check": "pending", "checks": "http://patchwork.ozlabs.org/api/patches/806998/checks/", "tags": {}, "related": [], "headers": { "Return-Path": "<devicetree-owner@vger.kernel.org>", "X-Original-To": "incoming-dt@patchwork.ozlabs.org", "Delivered-To": "patchwork-incoming-dt@bilbo.ozlabs.org", "Authentication-Results": "ozlabs.org;\n\tspf=none (mailfrom) smtp.mailfrom=vger.kernel.org\n\t(client-ip=209.132.180.67; helo=vger.kernel.org;\n\tenvelope-from=devicetree-owner@vger.kernel.org; receiver=<UNKNOWN>)", "Received": [ "from vger.kernel.org (vger.kernel.org [209.132.180.67])\n\tby ozlabs.org (Postfix) with ESMTP id 3xhMBb6j76z9t3J\n\tfor <incoming-dt@patchwork.ozlabs.org>;\n\tTue, 29 Aug 2017 18:24:55 +1000 (AEST)", "(majordomo@vger.kernel.org) by vger.kernel.org via listexpand\n\tid S1751375AbdH2IYM (ORCPT\n\t<rfc822;incoming-dt@patchwork.ozlabs.org>);\n\tTue, 29 Aug 2017 04:24:12 -0400", "from szxga04-in.huawei.com ([45.249.212.190]:5482 \"EHLO\n\tszxga04-in.huawei.com\" rhost-flags-OK-OK-OK-OK) by vger.kernel.org\n\twith ESMTP id S1751294AbdH2IYG (ORCPT\n\t<rfc822; devicetree@vger.kernel.org>); Tue, 29 Aug 2017 04:24:06 -0400", "from 172.30.72.59 (EHLO DGGEMS401-HUB.china.huawei.com)\n\t([172.30.72.59])\n\tby dggrg04-dlp.huawei.com (MOS 4.4.6-GA FastPath queued)\n\twith ESMTP id DGC68823; Tue, 29 Aug 2017 16:24:04 +0800 (CST)", "from HSH1000038028.huawei.com (10.177.161.152) by\n\tDGGEMS401-HUB.china.huawei.com (10.3.19.201) with Microsoft SMTP\n\tServer id 14.3.301.0; Tue, 29 Aug 2017 16:23:54 +0800" ], "From": "Tao Wang <kevin.wangtao@hisilicon.com>", "To": "<rui.zhang@intel.com>, <edubezval@gmail.com>, <robh+dt@kernel.org>,\n\t<mark.rutland@arm.com>, <xuwei5@hisilicon.com>,\n\t<catalin.marinas@arm.com>, <will.deacon@arm.com>", "CC": "<leo.yan@linaro.org>, <kevin.wangtao@linaro.org>,\n\t<linux-pm@vger.kernel.org>, <devicetree@vger.kernel.org>,\n\t<linux-kernel@vger.kernel.org>, <linux-arm-kernel@lists.infradead.org>,\n\t<sunzhaosheng@hisilicon.com>, <gengyanping@hisilicon.com>", "Subject": "[PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor\n\tbindings", "Date": "Tue, 29 Aug 2017 16:17:44 +0800", "Message-ID": "<1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com>", "X-Mailer": "git-send-email 2.8.1", "In-Reply-To": "<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>", "References": "<e313015d-11d5-91b8-aa64-37e9410cb882@hisilicon.com>\n\t<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>", "MIME-Version": "1.0", "Content-Type": "text/plain", "X-Originating-IP": "[10.177.161.152]", "X-CFilter-Loop": "Reflected", "X-Mirapoint-Virus-RAPID-Raw": "score=unknown(0),\n\trefid=str=0001.0A090203.59A524A4.0059, ss=1, re=0.000, recu=0.000,\n\treip=0.000, cl=1, cld=1, fgs=0, ip=0.0.0.0,\n\tso=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32", "X-Mirapoint-Loop-Id": "bc4b412c19a7039dd17be252292c34a6", "Sender": "devicetree-owner@vger.kernel.org", "Precedence": "bulk", "List-ID": "<devicetree.vger.kernel.org>", "X-Mailing-List": "devicetree@vger.kernel.org" }, "content": "From: Tao Wang <kevin.wangtao@linaro.org>\n\nThis adds documentation of device tree bindings for the\nthermal sensor controller of hi3660 SoC.\n\nSigned-off-by: Tao Wang <kevin.wangtao@linaro.org>\n---\n .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++\n 1 file changed, 37 insertions(+)\n create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt", "diff": "diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt\nnew file mode 100644\nindex 0000000..4643dbe\n--- /dev/null\n+++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt\n@@ -0,0 +1,37 @@\n+* Temperature Sensor on hisilicon SoC\n+\n+Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D\n+area contains a temperture sensor. The temperture sensor produces an output\n+value which has a linear relationship with the temperture of the area.\n+\n+for Hi3660,\n+sensor0 monitors the temperture of A53;\n+sensor1 monitors the temperture of A72;\n+sensor2 monitors the temperture of GPU;\n+sensor3 is a virtual sensor, which produces the maximum value of all sensors;\n+sensor4 is a virtual sensor, which produces the average value of all sensors.\n+\n+** Required properties :\n+- compatible: \"hisilicon,thermal-tsensor\".\n+- reg: physical reg address of thermal sensor and length of memory mapped\n+ region.\n+- hisi,tsensors: number of hardware tsensors\n+- hisi,coef:\tAn array of integers (one signed cell) containing\n+\t\tcoefficients to turn adc value to temperture.\n+- hisi,adc-range: adc value range, minimum value is followed by maximum value.\n+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.\n+\n+Example :\n+Hi3660:\n+tsensor: tsensor@fff30000 {\n+\tcompatible = \"hisilicon,hi3660-tsensor\";\n+\t#address-cells = <2>;\n+\t#size-cells = <2>;\n+\treg = <0x0 0xfff3001c 0x0 0x4>,\n+\t\t<0x0 0xfff3005c 0x0 0x4>,\n+\t\t<0x0 0xfff3009c 0x0 0x4>;\n+\thisi,tsensors = <HISI_MAX_TSENSORS>;\n+\thisi,coef = <165000 (-40000)>;\n+\thisi,adc-range = <0x74 0x39A>;\n+\t#thermal-sensor-cells = <1>;\n+};\n", "prefixes": [ "v4", "1/3" ] }