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{ "id": 806997, "url": "http://patchwork.ozlabs.org/api/covers/806997/?format=api", "web_url": "http://patchwork.ozlabs.org/project/devicetree-bindings/cover/1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com/", "project": { "id": 37, "url": "http://patchwork.ozlabs.org/api/projects/37/?format=api", "name": "Devicetree Bindings", "link_name": "devicetree-bindings", "list_id": "devicetree.vger.kernel.org", "list_email": "devicetree@vger.kernel.org", "web_url": "", "scm_url": "", "webscm_url": "", "list_archive_url": "", "list_archive_url_format": "", "commit_url_format": "" }, "msgid": "<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>", "list_archive_url": null, "date": "2017-08-29T08:17:43", "name": "[v4,0/3] thermal: add thermal sensor driver for Hi3660", "submitter": { "id": 71830, "url": "http://patchwork.ozlabs.org/api/people/71830/?format=api", "name": "Wangtao (Kevin, Kirin)", "email": "kevin.wangtao@hisilicon.com" }, "mbox": "http://patchwork.ozlabs.org/project/devicetree-bindings/cover/1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com/mbox/", "series": [ { "id": 324, "url": "http://patchwork.ozlabs.org/api/series/324/?format=api", "web_url": "http://patchwork.ozlabs.org/project/devicetree-bindings/list/?series=324", "date": "2017-08-29T08:17:43", "name": "thermal: add thermal sensor driver for Hi3660", "version": 4, "mbox": "http://patchwork.ozlabs.org/series/324/mbox/" } ], "comments": "http://patchwork.ozlabs.org/api/covers/806997/comments/", "headers": { "Return-Path": "<devicetree-owner@vger.kernel.org>", "X-Original-To": "incoming-dt@patchwork.ozlabs.org", "Delivered-To": "patchwork-incoming-dt@bilbo.ozlabs.org", "Authentication-Results": "ozlabs.org;\n\tspf=none (mailfrom) smtp.mailfrom=vger.kernel.org\n\t(client-ip=209.132.180.67; helo=vger.kernel.org;\n\tenvelope-from=devicetree-owner@vger.kernel.org; receiver=<UNKNOWN>)", "Received": [ "from vger.kernel.org (vger.kernel.org [209.132.180.67])\n\tby ozlabs.org (Postfix) with ESMTP id 3xhM9g5pchz9t3J\n\tfor <incoming-dt@patchwork.ozlabs.org>;\n\tTue, 29 Aug 2017 18:24:07 +1000 (AEST)", "(majordomo@vger.kernel.org) by vger.kernel.org via listexpand\n\tid S1751333AbdH2IYF (ORCPT\n\t<rfc822;incoming-dt@patchwork.ozlabs.org>);\n\tTue, 29 Aug 2017 04:24:05 -0400", "from szxga04-in.huawei.com ([45.249.212.190]:5481 \"EHLO\n\tszxga04-in.huawei.com\" rhost-flags-OK-OK-OK-OK) by vger.kernel.org\n\twith ESMTP id S1751218AbdH2IYE (ORCPT\n\t<rfc822; devicetree@vger.kernel.org>); Tue, 29 Aug 2017 04:24:04 -0400", "from 172.30.72.60 (EHLO DGGEMS401-HUB.china.huawei.com)\n\t([172.30.72.60])\n\tby dggrg04-dlp.huawei.com (MOS 4.4.6-GA FastPath queued)\n\twith ESMTP id DGC68810; Tue, 29 Aug 2017 16:23:59 +0800 (CST)", "from HSH1000038028.huawei.com (10.177.161.152) by\n\tDGGEMS401-HUB.china.huawei.com (10.3.19.201) with Microsoft SMTP\n\tServer id 14.3.301.0; Tue, 29 Aug 2017 16:23:51 +0800" ], "From": "Tao Wang <kevin.wangtao@hisilicon.com>", "To": "<rui.zhang@intel.com>, <edubezval@gmail.com>, <robh+dt@kernel.org>,\n\t<mark.rutland@arm.com>, <xuwei5@hisilicon.com>,\n\t<catalin.marinas@arm.com>, <will.deacon@arm.com>", "CC": "<leo.yan@linaro.org>, <kevin.wangtao@linaro.org>,\n\t<linux-pm@vger.kernel.org>, <devicetree@vger.kernel.org>,\n\t<linux-kernel@vger.kernel.org>, <linux-arm-kernel@lists.infradead.org>,\n\t<sunzhaosheng@hisilicon.com>, <gengyanping@hisilicon.com>", "Subject": "[PATCH v4 0/3] thermal: add thermal sensor driver for Hi3660", "Date": "Tue, 29 Aug 2017 16:17:43 +0800", "Message-ID": "<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>", "X-Mailer": "git-send-email 2.8.1", "In-Reply-To": "<e313015d-11d5-91b8-aa64-37e9410cb882@hisilicon.com>", "References": "<e313015d-11d5-91b8-aa64-37e9410cb882@hisilicon.com>", "MIME-Version": "1.0", "Content-Type": "text/plain", "X-Originating-IP": "[10.177.161.152]", "X-CFilter-Loop": "Reflected", "X-Mirapoint-Virus-RAPID-Raw": "score=unknown(0),\n\trefid=str=0001.0A090201.59A524A0.0007, ss=1, re=0.000, recu=0.000,\n\treip=0.000, cl=1, cld=1, fgs=0, ip=0.0.0.0,\n\tso=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32", "X-Mirapoint-Loop-Id": "492310392692deaad36e714d2d76a4c3", "Sender": "devicetree-owner@vger.kernel.org", "Precedence": "bulk", "List-ID": "<devicetree.vger.kernel.org>", "X-Mailing-List": "devicetree@vger.kernel.org" }, "content": "From: Tao Wang <kevin.wangtao@linaro.org>\n\nThis series adds thermal support for Hi3660 Soc, which support\nall the hardware temperture sensors and two virtual sensors(one\nfor maximum value of all and one for average value of all).\n\nPatch 1 add dt-binding document to describe how to config dt\nfor the driver.\nPatch 2 introduces the thermal sensor driver.\nPatch 3 add dts for the thermal senor driver on Hi3660.\n\nChanges in v2:\n- correct alphabet order\n- correct compatible name\n- remove redundant property\n- rebase changes on linux next\n\nChanges in v3:\n- remove unnecessary log print\n- described all platform related parameters in DT\n- make the driver forward compatible\n\nChanges in v4:\n- add more description about the sensor in Documentation\n- correct dts property name\n\nTao Wang (3):\n dt-bindings: Document the hi3660 thermal sensor bindings\n thermal: hisilicon: add thermal sensor driver for Hi3660\n arm64: dts: register Hi3660's thermal sensor\n\n .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++\n arch/arm64/boot/dts/hisilicon/hi3660.dtsi | 14 ++\n drivers/thermal/Kconfig | 13 ++\n drivers/thermal/Makefile | 1 +\n drivers/thermal/hisi_tsensor.c | 209 +++++++++++++++++++++\n include/dt-bindings/thermal/hi3660-thermal.h | 31 +++\n 6 files changed, 305 insertions(+)\n create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt\n create mode 100644 drivers/thermal/hisi_tsensor.c\n create mode 100644 include/dt-bindings/thermal/hi3660-thermal.h" }