| Message ID | 20230815223108.306018-6-mailingradian@gmail.com |
|---|---|
| State | Not Applicable, archived |
| Headers | show |
| Series | SDM670 CPU frequency scaling: dtschema fixes | expand |
| Context | Check | Description |
|---|---|---|
| robh/checkpatch | success | |
| robh/patch-applied | success | |
| robh/dtbs-check | warning | build log |
| robh/dt-meta-schema | success |
On Tue, Aug 15, 2023 at 06:31:10PM -0400, Richard Acayan wrote: > Add the compatible for the OSM L3 interconnect used in the Snapdragon > 670. > > Signed-off-by: Richard Acayan <mailingradian@gmail.com> > Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> > --- The subject line should be "dt-bindings: interconnect: OSM L3: add SDM670 compatible" to follow the same format as other patches to this file. > Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml | 1 + > 1 file changed, 1 insertion(+) > > diff --git a/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml b/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml > index 9d0a98d77ae9..21dae0b92819 100644 > --- a/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml > +++ b/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml > @@ -21,6 +21,7 @@ properties: > - enum: > - qcom,sc7180-osm-l3 > - qcom,sc8180x-osm-l3 > + - qcom,sdm670-osm-l3 > - qcom,sdm845-osm-l3 > - qcom,sm6350-osm-l3 > - qcom,sm8150-osm-l3 > -- > 2.41.0 >
diff --git a/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml b/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml index 9d0a98d77ae9..21dae0b92819 100644 --- a/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml +++ b/Documentation/devicetree/bindings/interconnect/qcom,osm-l3.yaml @@ -21,6 +21,7 @@ properties: - enum: - qcom,sc7180-osm-l3 - qcom,sc8180x-osm-l3 + - qcom,sdm670-osm-l3 - qcom,sdm845-osm-l3 - qcom,sm6350-osm-l3 - qcom,sm8150-osm-l3