{"id":817424,"url":"http://patchwork.ozlabs.org/api/patches/817424/?format=json","web_url":"http://patchwork.ozlabs.org/project/devicetree-bindings/patch/1506073332-92438-8-git-send-email-kevin.wangtao@hisilicon.com/","project":{"id":37,"url":"http://patchwork.ozlabs.org/api/projects/37/?format=json","name":"Devicetree Bindings","link_name":"devicetree-bindings","list_id":"devicetree.vger.kernel.org","list_email":"devicetree@vger.kernel.org","web_url":"","scm_url":"","webscm_url":"","list_archive_url":"","list_archive_url_format":"","commit_url_format":""},"msgid":"<1506073332-92438-8-git-send-email-kevin.wangtao@hisilicon.com>","list_archive_url":null,"date":"2017-09-22T09:42:10","name":"[7/9] dt-bindings: Document the hi3660 thermal sensor binding","commit_ref":null,"pull_url":null,"state":"not-applicable","archived":true,"hash":"7bebf4a760dd3689fcd7cb883185408f3b390482","submitter":{"id":71830,"url":"http://patchwork.ozlabs.org/api/people/71830/?format=json","name":"Wangtao (Kevin, Kirin)","email":"kevin.wangtao@hisilicon.com"},"delegate":null,"mbox":"http://patchwork.ozlabs.org/project/devicetree-bindings/patch/1506073332-92438-8-git-send-email-kevin.wangtao@hisilicon.com/mbox/","series":[{"id":4589,"url":"http://patchwork.ozlabs.org/api/series/4589/?format=json","web_url":"http://patchwork.ozlabs.org/project/devicetree-bindings/list/?series=4589","date":"2017-09-22T09:42:03","name":"add support for Hi3660 tsensor","version":1,"mbox":"http://patchwork.ozlabs.org/series/4589/mbox/"}],"comments":"http://patchwork.ozlabs.org/api/patches/817424/comments/","check":"pending","checks":"http://patchwork.ozlabs.org/api/patches/817424/checks/","tags":{},"related":[],"headers":{"Return-Path":"<devicetree-owner@vger.kernel.org>","X-Original-To":"incoming-dt@patchwork.ozlabs.org","Delivered-To":"patchwork-incoming-dt@bilbo.ozlabs.org","Authentication-Results":"ozlabs.org;\n\tspf=none (mailfrom) smtp.mailfrom=vger.kernel.org\n\t(client-ip=209.132.180.67; helo=vger.kernel.org;\n\tenvelope-from=devicetree-owner@vger.kernel.org; receiver=<UNKNOWN>)","Received":["from vger.kernel.org (vger.kernel.org [209.132.180.67])\n\tby ozlabs.org (Postfix) with ESMTP id 3xz7y36zRPz9sPm\n\tfor <incoming-dt@patchwork.ozlabs.org>;\n\tFri, 22 Sep 2017 19:50:19 +1000 (AEST)","(majordomo@vger.kernel.org) by vger.kernel.org via listexpand\n\tid S1751985AbdIVJuH (ORCPT\n\t<rfc822;incoming-dt@patchwork.ozlabs.org>);\n\tFri, 22 Sep 2017 05:50:07 -0400","from szxga05-in.huawei.com ([45.249.212.191]:6548 \"EHLO\n\tszxga05-in.huawei.com\" rhost-flags-OK-OK-OK-OK) by vger.kernel.org\n\twith ESMTP id S1752091AbdIVJt3 (ORCPT\n\t<rfc822; devicetree@vger.kernel.org>); Fri, 22 Sep 2017 05:49:29 -0400","from 172.30.72.58 (EHLO DGGEMS403-HUB.china.huawei.com)\n\t([172.30.72.58])\n\tby dggrg05-dlp.huawei.com (MOS 4.4.6-GA FastPath queued)\n\twith ESMTP id DHV05250; Fri, 22 Sep 2017 17:49:26 +0800 (CST)","from HSH1000038028.huawei.com (10.177.161.152) by\n\tDGGEMS403-HUB.china.huawei.com (10.3.19.203) with Microsoft SMTP\n\tServer id 14.3.301.0; Fri, 22 Sep 2017 17:49:17 +0800"],"From":"Tao Wang <kevin.wangtao@hisilicon.com>","To":"<rui.zhang@intel.com>, <edubezval@gmail.com>, <robh+dt@kernel.org>,\n\t<mark.rutland@arm.com>, <xuwei5@hisilicon.com>,\n\t<catalin.marinas@arm.com>, <will.deacon@arm.com>","CC":"<leo.yan@linaro.org>, <lonela.Voinescu@arm.com>,\n\t<Valentin.Schneider@arm.com>, <vincent.guittot@linaro.org>,\n\t<daniel.lezcano@linaro.org>, <sunzhaosheng@hisilicon.com>,\n\t<gengyanping@hisilicon.com>, <linux-pm@vger.kernel.org>,\n\t<devicetree@vger.kernel.org>, <linux-kernel@vger.kernel.org>,\n\t<linux-arm-kernel@lists.infradead.org>,\n\tKevin Wangtao <kevin.wangtao@linaro.org>","Subject":"[PATCH 7/9] dt-bindings: Document the hi3660 thermal sensor binding","Date":"Fri, 22 Sep 2017 17:42:10 +0800","Message-ID":"<1506073332-92438-8-git-send-email-kevin.wangtao@hisilicon.com>","X-Mailer":"git-send-email 2.8.1","In-Reply-To":"<1506073332-92438-1-git-send-email-kevin.wangtao@hisilicon.com>","References":"<1506073332-92438-1-git-send-email-kevin.wangtao@hisilicon.com>","MIME-Version":"1.0","Content-Type":"text/plain","X-Originating-IP":"[10.177.161.152]","X-CFilter-Loop":"Reflected","X-Mirapoint-Virus-RAPID-Raw":"score=unknown(0),\n\trefid=str=0001.0A020201.59C4DCA7.0011, ss=1, re=0.000, recu=0.000,\n\treip=0.000, cl=1, cld=1, fgs=0, ip=0.0.0.0,\n\tso=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32","X-Mirapoint-Loop-Id":"39fc0f64840947bf4c6b1c67c96df37e","Sender":"devicetree-owner@vger.kernel.org","Precedence":"bulk","List-ID":"<devicetree.vger.kernel.org>","X-Mailing-List":"devicetree@vger.kernel.org"},"content":"From: Kevin Wangtao <kevin.wangtao@linaro.org>\n\nThis adds documentation of device tree bindings for the\nthermal sensor controller of hi3660 SoC.\n\nSigned-off-by: Kevin Wangtao <kevin.wangtao@linaro.org>\n---\n Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt | 9 +++++++++\n 1 file changed, 9 insertions(+)","diff":"diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt\nindex d48fc52..cef716a 100644\n--- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt\n+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt\n@@ -13,6 +13,7 @@\n \n Example :\n \n+for Hi6220:\n \ttsensor: tsensor@0,f7030700 {\n \t\tcompatible = \"hisilicon,tsensor\";\n \t\treg = <0x0 0xf7030700 0x0 0x1000>;\n@@ -21,3 +22,11 @@ Example :\n \t\tclock-names = \"thermal_clk\";\n \t\t#thermal-sensor-cells = <1>;\n \t}\n+\n+for Hi3660:\n+\ttsensor: tsensor@fff30000 {\n+\t\tcompatible = \"hisilicon,hi3660-tsensor\";\n+\t\treg = <0x0 0xfff30000 0x0 0x1000>;\n+\t\tinterrupts = <GIC_SPI 145 IRQ_TYPE_LEVEL_HIGH>;\n+\t\t#thermal-sensor-cells = <1>;\n+\t};\n","prefixes":["7/9"]}