{"id":806998,"url":"http://patchwork.ozlabs.org/api/1.0/patches/806998/?format=json","project":{"id":37,"url":"http://patchwork.ozlabs.org/api/1.0/projects/37/?format=json","name":"Devicetree Bindings","link_name":"devicetree-bindings","list_id":"devicetree.vger.kernel.org","list_email":"devicetree@vger.kernel.org","web_url":"","scm_url":"","webscm_url":""},"msgid":"<1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com>","date":"2017-08-29T08:17:44","name":"[v4,1/3] dt-bindings: Document the hi3660 thermal sensor bindings","commit_ref":null,"pull_url":null,"state":"changes-requested","archived":true,"hash":"36227f98611886b0fe39f807ed730224b17b1395","submitter":{"id":71830,"url":"http://patchwork.ozlabs.org/api/1.0/people/71830/?format=json","name":"Wangtao (Kevin, Kirin)","email":"kevin.wangtao@hisilicon.com"},"delegate":null,"mbox":"http://patchwork.ozlabs.org/project/devicetree-bindings/patch/1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com/mbox/","series":[{"id":324,"url":"http://patchwork.ozlabs.org/api/1.0/series/324/?format=json","date":"2017-08-29T08:17:43","name":"thermal: add thermal sensor driver for Hi3660","version":4,"mbox":"http://patchwork.ozlabs.org/series/324/mbox/"}],"check":"pending","checks":"http://patchwork.ozlabs.org/api/patches/806998/checks/","tags":{},"headers":{"Return-Path":"","X-Original-To":"incoming-dt@patchwork.ozlabs.org","Delivered-To":"patchwork-incoming-dt@bilbo.ozlabs.org","Authentication-Results":"ozlabs.org;\n\tspf=none (mailfrom) smtp.mailfrom=vger.kernel.org\n\t(client-ip=209.132.180.67; helo=vger.kernel.org;\n\tenvelope-from=devicetree-owner@vger.kernel.org; receiver=)","Received":["from vger.kernel.org (vger.kernel.org [209.132.180.67])\n\tby ozlabs.org (Postfix) with ESMTP id 3xhMBb6j76z9t3J\n\tfor ;\n\tTue, 29 Aug 2017 18:24:55 +1000 (AEST)","(majordomo@vger.kernel.org) by vger.kernel.org via listexpand\n\tid S1751375AbdH2IYM (ORCPT\n\t);\n\tTue, 29 Aug 2017 04:24:12 -0400","from szxga04-in.huawei.com ([45.249.212.190]:5482 \"EHLO\n\tszxga04-in.huawei.com\" rhost-flags-OK-OK-OK-OK) by vger.kernel.org\n\twith ESMTP id S1751294AbdH2IYG (ORCPT\n\t); Tue, 29 Aug 2017 04:24:06 -0400","from 172.30.72.59 (EHLO DGGEMS401-HUB.china.huawei.com)\n\t([172.30.72.59])\n\tby dggrg04-dlp.huawei.com (MOS 4.4.6-GA FastPath queued)\n\twith ESMTP id DGC68823; Tue, 29 Aug 2017 16:24:04 +0800 (CST)","from HSH1000038028.huawei.com (10.177.161.152) by\n\tDGGEMS401-HUB.china.huawei.com (10.3.19.201) with Microsoft SMTP\n\tServer id 14.3.301.0; Tue, 29 Aug 2017 16:23:54 +0800"],"From":"Tao Wang ","To":", , ,\n\t, ,\n\t, ","CC":", ,\n\t, ,\n\t, ,\n\t, ","Subject":"[PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor\n\tbindings","Date":"Tue, 29 Aug 2017 16:17:44 +0800","Message-ID":"<1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com>","X-Mailer":"git-send-email 2.8.1","In-Reply-To":"<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>","References":"\n\t<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>","MIME-Version":"1.0","Content-Type":"text/plain","X-Originating-IP":"[10.177.161.152]","X-CFilter-Loop":"Reflected","X-Mirapoint-Virus-RAPID-Raw":"score=unknown(0),\n\trefid=str=0001.0A090203.59A524A4.0059, ss=1, re=0.000, recu=0.000,\n\treip=0.000, cl=1, cld=1, fgs=0, ip=0.0.0.0,\n\tso=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32","X-Mirapoint-Loop-Id":"bc4b412c19a7039dd17be252292c34a6","Sender":"devicetree-owner@vger.kernel.org","Precedence":"bulk","List-ID":"","X-Mailing-List":"devicetree@vger.kernel.org"},"content":"From: Tao Wang \n\nThis adds documentation of device tree bindings for the\nthermal sensor controller of hi3660 SoC.\n\nSigned-off-by: Tao Wang \n---\n .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++\n 1 file changed, 37 insertions(+)\n create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt","diff":"diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt\nnew file mode 100644\nindex 0000000..4643dbe\n--- /dev/null\n+++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt\n@@ -0,0 +1,37 @@\n+* Temperature Sensor on hisilicon SoC\n+\n+Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D\n+area contains a temperture sensor. The temperture sensor produces an output\n+value which has a linear relationship with the temperture of the area.\n+\n+for Hi3660,\n+sensor0 monitors the temperture of A53;\n+sensor1 monitors the temperture of A72;\n+sensor2 monitors the temperture of GPU;\n+sensor3 is a virtual sensor, which produces the maximum value of all sensors;\n+sensor4 is a virtual sensor, which produces the average value of all sensors.\n+\n+** Required properties :\n+- compatible: \"hisilicon,thermal-tsensor\".\n+- reg: physical reg address of thermal sensor and length of memory mapped\n+ region.\n+- hisi,tsensors: number of hardware tsensors\n+- hisi,coef:\tAn array of integers (one signed cell) containing\n+\t\tcoefficients to turn adc value to temperture.\n+- hisi,adc-range: adc value range, minimum value is followed by maximum value.\n+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.\n+\n+Example :\n+Hi3660:\n+tsensor: tsensor@fff30000 {\n+\tcompatible = \"hisilicon,hi3660-tsensor\";\n+\t#address-cells = <2>;\n+\t#size-cells = <2>;\n+\treg = <0x0 0xfff3001c 0x0 0x4>,\n+\t\t<0x0 0xfff3005c 0x0 0x4>,\n+\t\t<0x0 0xfff3009c 0x0 0x4>;\n+\thisi,tsensors = ;\n+\thisi,coef = <165000 (-40000)>;\n+\thisi,adc-range = <0x74 0x39A>;\n+\t#thermal-sensor-cells = <1>;\n+};\n","prefixes":["v4","1/3"]}