{"id":806997,"url":"http://patchwork.ozlabs.org/api/1.0/covers/806997/?format=json","project":{"id":37,"url":"http://patchwork.ozlabs.org/api/1.0/projects/37/?format=json","name":"Devicetree Bindings","link_name":"devicetree-bindings","list_id":"devicetree.vger.kernel.org","list_email":"devicetree@vger.kernel.org","web_url":"","scm_url":"","webscm_url":""},"msgid":"<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>","date":"2017-08-29T08:17:43","name":"[v4,0/3] thermal: add thermal sensor driver for Hi3660","submitter":{"id":71830,"url":"http://patchwork.ozlabs.org/api/1.0/people/71830/?format=json","name":"Wangtao (Kevin, Kirin)","email":"kevin.wangtao@hisilicon.com"},"series":[{"id":324,"url":"http://patchwork.ozlabs.org/api/1.0/series/324/?format=json","date":"2017-08-29T08:17:43","name":"thermal: add thermal sensor driver for Hi3660","version":4,"mbox":"http://patchwork.ozlabs.org/series/324/mbox/"}],"headers":{"Return-Path":"<devicetree-owner@vger.kernel.org>","X-Original-To":"incoming-dt@patchwork.ozlabs.org","Delivered-To":"patchwork-incoming-dt@bilbo.ozlabs.org","Authentication-Results":"ozlabs.org;\n\tspf=none (mailfrom) smtp.mailfrom=vger.kernel.org\n\t(client-ip=209.132.180.67; helo=vger.kernel.org;\n\tenvelope-from=devicetree-owner@vger.kernel.org; receiver=<UNKNOWN>)","Received":["from vger.kernel.org (vger.kernel.org [209.132.180.67])\n\tby ozlabs.org (Postfix) with ESMTP id 3xhM9g5pchz9t3J\n\tfor <incoming-dt@patchwork.ozlabs.org>;\n\tTue, 29 Aug 2017 18:24:07 +1000 (AEST)","(majordomo@vger.kernel.org) by vger.kernel.org via listexpand\n\tid S1751333AbdH2IYF (ORCPT\n\t<rfc822;incoming-dt@patchwork.ozlabs.org>);\n\tTue, 29 Aug 2017 04:24:05 -0400","from szxga04-in.huawei.com ([45.249.212.190]:5481 \"EHLO\n\tszxga04-in.huawei.com\" rhost-flags-OK-OK-OK-OK) by vger.kernel.org\n\twith ESMTP id S1751218AbdH2IYE (ORCPT\n\t<rfc822; devicetree@vger.kernel.org>); Tue, 29 Aug 2017 04:24:04 -0400","from 172.30.72.60 (EHLO DGGEMS401-HUB.china.huawei.com)\n\t([172.30.72.60])\n\tby dggrg04-dlp.huawei.com (MOS 4.4.6-GA FastPath queued)\n\twith ESMTP id DGC68810; Tue, 29 Aug 2017 16:23:59 +0800 (CST)","from HSH1000038028.huawei.com (10.177.161.152) by\n\tDGGEMS401-HUB.china.huawei.com (10.3.19.201) with Microsoft SMTP\n\tServer id 14.3.301.0; Tue, 29 Aug 2017 16:23:51 +0800"],"From":"Tao Wang <kevin.wangtao@hisilicon.com>","To":"<rui.zhang@intel.com>, <edubezval@gmail.com>, <robh+dt@kernel.org>,\n\t<mark.rutland@arm.com>, <xuwei5@hisilicon.com>,\n\t<catalin.marinas@arm.com>, <will.deacon@arm.com>","CC":"<leo.yan@linaro.org>, <kevin.wangtao@linaro.org>,\n\t<linux-pm@vger.kernel.org>, <devicetree@vger.kernel.org>,\n\t<linux-kernel@vger.kernel.org>, <linux-arm-kernel@lists.infradead.org>,\n\t<sunzhaosheng@hisilicon.com>, <gengyanping@hisilicon.com>","Subject":"[PATCH v4 0/3] thermal: add thermal sensor driver for Hi3660","Date":"Tue, 29 Aug 2017 16:17:43 +0800","Message-ID":"<1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com>","X-Mailer":"git-send-email 2.8.1","In-Reply-To":"<e313015d-11d5-91b8-aa64-37e9410cb882@hisilicon.com>","References":"<e313015d-11d5-91b8-aa64-37e9410cb882@hisilicon.com>","MIME-Version":"1.0","Content-Type":"text/plain","X-Originating-IP":"[10.177.161.152]","X-CFilter-Loop":"Reflected","X-Mirapoint-Virus-RAPID-Raw":"score=unknown(0),\n\trefid=str=0001.0A090201.59A524A0.0007, ss=1, re=0.000, recu=0.000,\n\treip=0.000, cl=1, cld=1, fgs=0, ip=0.0.0.0,\n\tso=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32","X-Mirapoint-Loop-Id":"492310392692deaad36e714d2d76a4c3","Sender":"devicetree-owner@vger.kernel.org","Precedence":"bulk","List-ID":"<devicetree.vger.kernel.org>","X-Mailing-List":"devicetree@vger.kernel.org"},"content":"From: Tao Wang <kevin.wangtao@linaro.org>\n\nThis series adds thermal support for Hi3660 Soc, which support\nall the hardware temperture sensors and two virtual sensors(one\nfor maximum value of all and one for average value of all).\n\nPatch 1 add dt-binding document to describe how to config dt\nfor the driver.\nPatch 2 introduces the thermal sensor driver.\nPatch 3 add dts for the thermal senor driver on Hi3660.\n\nChanges in v2:\n- correct alphabet order\n- correct compatible name\n- remove redundant property\n- rebase changes on linux next\n\nChanges in v3:\n- remove unnecessary log print\n- described all platform related parameters in DT\n- make the driver forward compatible\n\nChanges in v4:\n- add more description about the sensor in Documentation\n- correct dts property name\n\nTao Wang (3):\n  dt-bindings: Document the hi3660 thermal sensor bindings\n  thermal: hisilicon: add thermal sensor driver for Hi3660\n  arm64: dts: register Hi3660's thermal sensor\n\n .../devicetree/bindings/thermal/hisi-tsensor.txt   |  37 ++++\n arch/arm64/boot/dts/hisilicon/hi3660.dtsi          |  14 ++\n drivers/thermal/Kconfig                            |  13 ++\n drivers/thermal/Makefile                           |   1 +\n drivers/thermal/hisi_tsensor.c                     | 209 +++++++++++++++++++++\n include/dt-bindings/thermal/hi3660-thermal.h       |  31 +++\n 6 files changed, 305 insertions(+)\n create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt\n create mode 100644 drivers/thermal/hisi_tsensor.c\n create mode 100644 include/dt-bindings/thermal/hi3660-thermal.h"}