diff mbox series

dt-bindings: thermal: Get rid of thermal.txt and replace references

Message ID e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org
State New
Headers show
Series dt-bindings: thermal: Get rid of thermal.txt and replace references | expand

Commit Message

Amit Kucheria July 20, 2020, 11:43 a.m. UTC
Now that we have yaml bindings for the thermal subsystem, get rid of the
old bindings (thermal.txt).

Replace all references to thermal.txt in the Documentation with a link
to the appropriate YAML bindings using the following search and replace
pattern:
 - If the reference is specific to the thermal-sensor-cells property,
 replace with a pointer to thermal-sensor.yaml
 - If the reference is to the cooling-cells property, replace with a
 pointer to thermal-cooling-devices.yaml
 - If the reference is generic thermal bindings, replace with a
 reference to thermal*.yaml.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
---
Changes since v1:
 - Rebase onto v.5.8-rc6 to make it apply again
 - Fix cpufreq/nvidia,tegra20-cpufreq.txt
 - Fix bindings/arm/freescale/fsl,scu.txt


 .../devicetree/bindings/arm/arm,scmi.txt      |   2 +-
 .../devicetree/bindings/arm/arm,scpi.txt      |   2 +-
 .../bindings/arm/freescale/fsl,scu.txt        |   2 +-
 .../arm/marvell/ap80x-system-controller.txt   |   2 +-
 .../arm/marvell/cp110-system-controller.txt   |   2 +-
 .../bindings/cpufreq/cpufreq-dt.txt           |   3 +-
 .../bindings/cpufreq/cpufreq-mediatek.txt     |   4 +-
 .../cpufreq/nvidia,tegra20-cpufreq.txt        |   2 +-
 .../devicetree/bindings/hwmon/gpio-fan.txt    |   3 +-
 .../devicetree/bindings/hwmon/lm90.txt        |   4 +-
 .../thermal/allwinner,sun8i-a83t-ths.yaml     |   2 +-
 .../bindings/thermal/amazon,al-thermal.txt    |   2 +-
 .../bindings/thermal/brcm,avs-ro-thermal.yaml |   2 +-
 .../bindings/thermal/brcm,bcm2835-thermal.txt |   2 +-
 .../bindings/thermal/hisilicon-thermal.txt    |   2 +-
 .../bindings/thermal/max77620_thermal.txt     |   6 +-
 .../bindings/thermal/mediatek-thermal.txt     |   2 +-
 .../thermal/nvidia,tegra124-soctherm.txt      |  10 +-
 .../thermal/nvidia,tegra186-bpmp-thermal.txt  |   2 +-
 .../bindings/thermal/qcom-spmi-temp-alarm.txt |   2 +-
 .../bindings/thermal/rockchip-thermal.txt     |   2 +-
 .../bindings/thermal/tango-thermal.txt        |   2 +-
 .../bindings/thermal/thermal-generic-adc.txt  |   2 +-
 .../devicetree/bindings/thermal/thermal.txt   | 586 ------------------
 24 files changed, 34 insertions(+), 616 deletions(-)
 delete mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt

Comments

Amit Kucheria July 20, 2020, 11:46 a.m. UTC | #1
On Mon, Jul 20, 2020 at 5:13 PM Amit Kucheria <amit.kucheria@linaro.org> wrote:
>
> Now that we have yaml bindings for the thermal subsystem, get rid of the
> old bindings (thermal.txt).
>
> Replace all references to thermal.txt in the Documentation with a link
> to the appropriate YAML bindings using the following search and replace
> pattern:
>  - If the reference is specific to the thermal-sensor-cells property,
>  replace with a pointer to thermal-sensor.yaml
>  - If the reference is to the cooling-cells property, replace with a
>  pointer to thermal-cooling-devices.yaml
>  - If the reference is generic thermal bindings, replace with a
>  reference to thermal*.yaml.
>
> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>

Please ignore. Forgot to add Rob's Ack and annotate with v2. Will resend.

> ---
> Changes since v1:
>  - Rebase onto v.5.8-rc6 to make it apply again
>  - Fix cpufreq/nvidia,tegra20-cpufreq.txt
>  - Fix bindings/arm/freescale/fsl,scu.txt
>
>
>  .../devicetree/bindings/arm/arm,scmi.txt      |   2 +-
>  .../devicetree/bindings/arm/arm,scpi.txt      |   2 +-
>  .../bindings/arm/freescale/fsl,scu.txt        |   2 +-
>  .../arm/marvell/ap80x-system-controller.txt   |   2 +-
>  .../arm/marvell/cp110-system-controller.txt   |   2 +-
>  .../bindings/cpufreq/cpufreq-dt.txt           |   3 +-
>  .../bindings/cpufreq/cpufreq-mediatek.txt     |   4 +-
>  .../cpufreq/nvidia,tegra20-cpufreq.txt        |   2 +-
>  .../devicetree/bindings/hwmon/gpio-fan.txt    |   3 +-
>  .../devicetree/bindings/hwmon/lm90.txt        |   4 +-
>  .../thermal/allwinner,sun8i-a83t-ths.yaml     |   2 +-
>  .../bindings/thermal/amazon,al-thermal.txt    |   2 +-
>  .../bindings/thermal/brcm,avs-ro-thermal.yaml |   2 +-
>  .../bindings/thermal/brcm,bcm2835-thermal.txt |   2 +-
>  .../bindings/thermal/hisilicon-thermal.txt    |   2 +-
>  .../bindings/thermal/max77620_thermal.txt     |   6 +-
>  .../bindings/thermal/mediatek-thermal.txt     |   2 +-
>  .../thermal/nvidia,tegra124-soctherm.txt      |  10 +-
>  .../thermal/nvidia,tegra186-bpmp-thermal.txt  |   2 +-
>  .../bindings/thermal/qcom-spmi-temp-alarm.txt |   2 +-
>  .../bindings/thermal/rockchip-thermal.txt     |   2 +-
>  .../bindings/thermal/tango-thermal.txt        |   2 +-
>  .../bindings/thermal/thermal-generic-adc.txt  |   2 +-
>  .../devicetree/bindings/thermal/thermal.txt   | 586 ------------------
>  24 files changed, 34 insertions(+), 616 deletions(-)
>  delete mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
>
> diff --git a/Documentation/devicetree/bindings/arm/arm,scmi.txt b/Documentation/devicetree/bindings/arm/arm,scmi.txt
> index 1f293ea24cd85..55deb68230ebb 100644
> --- a/Documentation/devicetree/bindings/arm/arm,scmi.txt
> +++ b/Documentation/devicetree/bindings/arm/arm,scmi.txt
> @@ -102,7 +102,7 @@ Required sub-node properties:
>  [0] http://infocenter.arm.com/help/topic/com.arm.doc.den0056a/index.html
>  [1] Documentation/devicetree/bindings/clock/clock-bindings.txt
>  [2] Documentation/devicetree/bindings/power/power-domain.yaml
> -[3] Documentation/devicetree/bindings/thermal/thermal.txt
> +[3] Documentation/devicetree/bindings/thermal/thermal*.yaml
>  [4] Documentation/devicetree/bindings/sram/sram.yaml
>  [5] Documentation/devicetree/bindings/reset/reset.txt
>
> diff --git a/Documentation/devicetree/bindings/arm/arm,scpi.txt b/Documentation/devicetree/bindings/arm/arm,scpi.txt
> index dd04d9d9a1b8e..bcd6c3ec471e6 100644
> --- a/Documentation/devicetree/bindings/arm/arm,scpi.txt
> +++ b/Documentation/devicetree/bindings/arm/arm,scpi.txt
> @@ -108,7 +108,7 @@ Required properties:
>
>  [0] http://infocenter.arm.com/help/topic/com.arm.doc.dui0922b/index.html
>  [1] Documentation/devicetree/bindings/clock/clock-bindings.txt
> -[2] Documentation/devicetree/bindings/thermal/thermal.txt
> +[2] Documentation/devicetree/bindings/thermal/thermal*.yaml
>  [3] Documentation/devicetree/bindings/sram/sram.yaml
>  [4] Documentation/devicetree/bindings/power/power-domain.yaml
>
> diff --git a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
> index 10b8459e49f8c..6064d98b10314 100644
> --- a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
> +++ b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
> @@ -176,7 +176,7 @@ Required properties:
>                                   "fsl,imx8qxp-sc-thermal"
>                                 followed by "fsl,imx-sc-thermal";
>
> -- #thermal-sensor-cells:       See Documentation/devicetree/bindings/thermal/thermal.txt
> +- #thermal-sensor-cells:       See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
>                                 for a description.
>
>  Example (imx8qxp):
> diff --git a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
> index 098d932fc9630..e31511255d8e3 100644
> --- a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
> +++ b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
> @@ -111,7 +111,7 @@ Thermal:
>  --------
>
>  For common binding part and usage, refer to
> -Documentation/devicetree/bindings/thermal/thermal.txt
> +Documentation/devicetree/bindings/thermal/thermal*.yaml
>
>  The thermal IP can probe the temperature all around the processor. It
>  may feature several channels, each of them wired to one sensor.
> diff --git a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
> index f982a8ed93968..a21f7709596c0 100644
> --- a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
> +++ b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
> @@ -203,7 +203,7 @@ It is possible to setup an overheat interrupt by giving at least one
>  critical point to any subnode of the thermal-zone node.
>
>  For common binding part and usage, refer to
> -Documentation/devicetree/bindings/thermal/thermal.txt
> +Documentation/devicetree/bindings/thermal/thermal*.yaml
>
>  Required properties:
>  - compatible: must be one of:
> diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
> index 332aed8f4597a..56f4423743838 100644
> --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
> +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
> @@ -18,7 +18,8 @@ Optional properties:
>    in unit of nanoseconds.
>  - voltage-tolerance: Specify the CPU voltage tolerance in percentage.
>  - #cooling-cells:
> -     Please refer to Documentation/devicetree/bindings/thermal/thermal.txt.
> +     Please refer to
> +     Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml.
>
>  Examples:
>
> diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
> index 0551c78619de8..ea4994b35207d 100644
> --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
> +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
> @@ -21,8 +21,8 @@ Optional properties:
>                flow is handled by hardware, hence no software "voltage tracking" is
>                needed.
>  - #cooling-cells:
> -       Please refer to Documentation/devicetree/bindings/thermal/thermal.txt
> -       for detail.
> +       For details, please refer to
> +       Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>
>  Example 1 (MT7623 SoC):
>
> diff --git a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
> index daeca6ae6b769..52a24b82fd864 100644
> --- a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
> +++ b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
> @@ -5,7 +5,7 @@ Required properties:
>  - clocks: Must contain an entry for the CPU clock.
>    See ../clocks/clock-bindings.txt for details.
>  - operating-points-v2: See ../bindings/opp/opp.txt for details.
> -- #cooling-cells: Should be 2. See ../thermal/thermal.txt for details.
> +- #cooling-cells: Should be 2. See ../thermal/thermal-cooling-devices.yaml for details.
>
>  For each opp entry in 'operating-points-v2' table:
>  - opp-supported-hw: Two bitfields indicating:
> diff --git a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
> index 2becdcfdc840c..f4cfa350f6a14 100644
> --- a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
> +++ b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
> @@ -12,7 +12,8 @@ Optional properties:
>  - alarm-gpios: This pin going active indicates something is wrong with
>    the fan, and a udev event will be fired.
>  - #cooling-cells: If used as a cooling device, must be <2>
> -  Also see: Documentation/devicetree/bindings/thermal/thermal.txt
> +  Also see:
> +  Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>    min and max states are derived from the speed-map of the fan.
>
>  Note: At least one the "gpios" or "alarm-gpios" properties must be set.
> diff --git a/Documentation/devicetree/bindings/hwmon/lm90.txt b/Documentation/devicetree/bindings/hwmon/lm90.txt
> index c76a7ac47c342..398dcb9657514 100644
> --- a/Documentation/devicetree/bindings/hwmon/lm90.txt
> +++ b/Documentation/devicetree/bindings/hwmon/lm90.txt
> @@ -34,8 +34,8 @@ Optional properties:
>                LM90 "-ALERT" pin output.
>                See interrupt-controller/interrupts.txt for the format.
>
> -- #thermal-sensor-cells: should be set to 1. See thermal/thermal.txt for
> -             details. See <include/dt-bindings/thermal/lm90.h> for the
> +- #thermal-sensor-cells: should be set to 1. See thermal/thermal-sensor.yaml
> +             for details. See <include/dt-bindings/thermal/lm90.h> for the
>               definition of the local, remote and 2nd remote sensor index
>               constants.
>
> diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
> index 87369264feb96..44ba6765697d8 100644
> --- a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
> +++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
> @@ -50,7 +50,7 @@ properties:
>    nvmem-cell-names:
>      const: calibration
>
> -  # See ./thermal.txt for details
> +  # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
>    "#thermal-sensor-cells":
>      enum:
>        - 0
> diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
> index 703979dbd577d..12fc4ef04837f 100644
> --- a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
> @@ -6,7 +6,7 @@ transaction.
>  Required properties:
>  - compatible: "amazon,al-thermal".
>  - reg: The physical base address and length of the sensor's registers.
> -- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description.
> +- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
>  Example:
>         thermal: thermal {
> diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
> index f3e68ed03abf8..1ab5070c751d5 100644
> --- a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
> +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
> @@ -23,7 +23,7 @@ properties:
>    compatible:
>      const: brcm,bcm2711-thermal
>
> -  # See ./thermal.txt for details
> +  # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
>    "#thermal-sensor-cells":
>      const: 0
>
> diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
> index da8c5b73ad105..a3e9ec5dc7ac4 100644
> --- a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
> @@ -7,7 +7,7 @@ compatible:             should be one of: "brcm,bcm2835-thermal",
>                         "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal"
>  reg:                   Address range of the thermal registers.
>  clocks:                Phandle of the clock used by the thermal sensor.
> -#thermal-sensor-cells: should be 0 (see thermal.txt)
> +#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
>
>  Example:
>
> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> index cef716a236f1a..4b19d80e6558b 100644
> --- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> @@ -9,7 +9,7 @@
>    by /SOCTHERM/tsensor.
>  - clock-names: Input clock name, should be 'thermal_clk'.
>  - clocks: phandles for clock specified in "clock-names" property.
> -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
>  Example :
>
> diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
> index 323a3b3822aac..82ed5d4879666 100644
> --- a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
> @@ -8,12 +8,12 @@ below threshold level.
>
>  Required properties:
>  -------------------
> -#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt>
> -                       for more details.
> +#thermal-sensor-cells: For more details, please refer to
> +                       <devicetree/bindings/thermal/thermal-sensor.yaml>
>                         The value must be 0.
>
>  For more details, please refer generic thermal DT binding document
> -<devicetree/bindings/thermal/thermal.txt>.
> +<devicetree/bindings/thermal/thermal*.yaml>.
>
>  Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
>  document for the MAX77620.
> diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
> index f8d7831f39740..1e249c42fae04 100644
> --- a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
> @@ -23,7 +23,7 @@ Required properties:
>  - resets: Reference to the reset controller controlling the thermal controller.
>  - mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses
>  - mediatek,apmixedsys: A phandle to the APMIXEDSYS controller.
> -- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description.
> +- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
>  Optional properties:
>  - nvmem-cells: A phandle to the calibration data provided by a nvmem device. If
> diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
> index f02f38527a6b6..db880e7ed713e 100644
> --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
> +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
> @@ -28,9 +28,10 @@ Required properties :
>    See ../reset/reset.txt for details.
>  - reset-names : Must include the following entries:
>    - soctherm
> -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description
> -    of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
> -    list of valid values when referring to thermal sensors.
> +- #thermal-sensor-cells : Should be 1. For a description of this property, see
> +     Documentation/devicetree/bindings/thermal/thermal-sensor.yaml.
> +    See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values
> +    when referring to thermal sensors.
>  - throttle-cfgs: A sub-node which is a container of configuration for each
>      hardware throttle events. These events can be set as cooling devices.
>    * throttle events: Sub-nodes must be named as "light" or "heavy".
> @@ -62,7 +63,8 @@ Required properties :
>          TEGRA_SOCTHERM_THROT_LEVEL_MED (75%),
>          TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%).
>        - #cooling-cells: Should be 1. This cooling device only support on/off state.
> -        See ./thermal.txt for a description of this property.
> +        For a description of this property see:
> +       Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>
>        Optional properties: The following properties are T210 specific and
>        valid only for OCx throttle events.
> diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
> index e17c07be270b7..fc87f6aa1b8f5 100644
> --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
> @@ -8,7 +8,7 @@ exposed by BPMP.
>  The BPMP thermal node must be located directly inside the main BPMP node. See
>  ../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding.
>
> -This node represents a thermal sensor. See thermal.txt for details of the
> +This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the
>  core thermal binding.
>
>  Required properties:
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
> index 0273a92a2a849..2d5b2ad03314b 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
> +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
> @@ -8,7 +8,7 @@ Required properties:
>  - compatible:      Should contain "qcom,spmi-temp-alarm".
>  - reg:             Specifies the SPMI address.
>  - interrupts:      PMIC temperature alarm interrupt.
> -- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
> +- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
>  Optional properties:
>  - io-channels:     Should contain IIO channel specifier for the ADC channel,
> diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
> index c6aac9bcacf1c..7f94669e9ebef 100644
> --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
> @@ -24,7 +24,7 @@ Required properties:
>  - pinctrl-1 : The "default" pinctrl state, it will be set after reset the
>               TSADC controller.
>  - pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend.
> -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description.
> +- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
>  Optional properties:
>  - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
> diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
> index 212198d4b9379..2c918d742867a 100644
> --- a/Documentation/devicetree/bindings/thermal/tango-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
> @@ -4,7 +4,7 @@ The SMP8758 SoC includes 3 instances of this temperature sensor
>  (in the CPU, video decoder, and PCIe controller).
>
>  Required properties:
> -- #thermal-sensor-cells: Should be 0 (see thermal.txt)
> +- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
>  - compatible: "sigma,smp8758-thermal"
>  - reg: Address range of the thermal registers
>
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
> index 691a09db2fefc..e136946a2f4fd 100644
> --- a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
> +++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
> @@ -8,7 +8,7 @@ temperature using voltage-temperature lookup table.
>  Required properties:
>  ===================
>  - compatible:               Must be "generic-adc-thermal".
> -- #thermal-sensor-cells:     Should be 1. See ./thermal.txt for a description
> +- #thermal-sensor-cells:     Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description
>                              of this property.
>  Optional properties:
>  ===================
> diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
> deleted file mode 100644
> index f78bec19ca358..0000000000000
> --- a/Documentation/devicetree/bindings/thermal/thermal.txt
> +++ /dev/null
> @@ -1,586 +0,0 @@
> -* Thermal Framework Device Tree descriptor
> -
> -This file describes a generic binding to provide a way of
> -defining hardware thermal structure using device tree.
> -A thermal structure includes thermal zones and their components,
> -such as trip points, polling intervals, sensors and cooling devices
> -binding descriptors.
> -
> -The target of device tree thermal descriptors is to describe only
> -the hardware thermal aspects. The thermal device tree bindings are
> -not about how the system must control or which algorithm or policy
> -must be taken in place.
> -
> -There are five types of nodes involved to describe thermal bindings:
> -- thermal sensors: devices which may be used to take temperature
> -  measurements.
> -- cooling devices: devices which may be used to dissipate heat.
> -- trip points: describe key temperatures at which cooling is recommended. The
> -  set of points should be chosen based on hardware limits.
> -- cooling maps: used to describe links between trip points and cooling devices;
> -- thermal zones: used to describe thermal data within the hardware;
> -
> -The following is a description of each of these node types.
> -
> -* Thermal sensor devices
> -
> -Thermal sensor devices are nodes providing temperature sensing capabilities on
> -thermal zones. Typical devices are I2C ADC converters and bandgaps. These are
> -nodes providing temperature data to thermal zones. Thermal sensor devices may
> -control one or more internal sensors.
> -
> -Required property:
> -- #thermal-sensor-cells: Used to provide sensor device specific information
> -  Type: unsigned        while referring to it. Typically 0 on thermal sensor
> -  Size: one cell        nodes with only one sensor, and at least 1 on nodes
> -                        with several internal sensors, in order
> -                        to identify uniquely the sensor instances within
> -                        the IC. See thermal zone binding for more details
> -                        on how consumers refer to sensor devices.
> -
> -* Cooling device nodes
> -
> -Cooling devices are nodes providing control on power dissipation. There
> -are essentially two ways to provide control on power dissipation. First
> -is by means of regulating device performance, which is known as passive
> -cooling. A typical passive cooling is a CPU that has dynamic voltage and
> -frequency scaling (DVFS), and uses lower frequencies as cooling states.
> -Second is by means of activating devices in order to remove
> -the dissipated heat, which is known as active cooling, e.g. regulating
> -fan speeds. In both cases, cooling devices shall have a way to determine
> -the state of cooling in which the device is.
> -
> -Any cooling device has a range of cooling states (i.e. different levels
> -of heat dissipation). For example a fan's cooling states correspond to
> -the different fan speeds possible. Cooling states are referred to by
> -single unsigned integers, where larger numbers mean greater heat
> -dissipation. The precise set of cooling states associated with a device
> -should be defined in a particular device's binding.
> -For more examples of cooling devices, refer to the example sections below.
> -
> -Required properties:
> -- #cooling-cells:      Used to provide cooling device specific information
> -  Type: unsigned       while referring to it. Must be at least 2, in order
> -  Size: one cell       to specify minimum and maximum cooling state used
> -                       in the reference. The first cell is the minimum
> -                       cooling state requested and the second cell is
> -                       the maximum cooling state requested in the reference.
> -                       See Cooling device maps section below for more details
> -                       on how consumers refer to cooling devices.
> -
> -* Trip points
> -
> -The trip node is a node to describe a point in the temperature domain
> -in which the system takes an action. This node describes just the point,
> -not the action.
> -
> -Required properties:
> -- temperature:         An integer indicating the trip temperature level,
> -  Type: signed         in millicelsius.
> -  Size: one cell
> -
> -- hysteresis:          A low hysteresis value on temperature property (above).
> -  Type: unsigned       This is a relative value, in millicelsius.
> -  Size: one cell
> -
> -- type:                        a string containing the trip type. Expected values are:
> -       "active":       A trip point to enable active cooling
> -       "passive":      A trip point to enable passive cooling
> -       "hot":          A trip point to notify emergency
> -       "critical":     Hardware not reliable.
> -  Type: string
> -
> -* Cooling device maps
> -
> -The cooling device maps node is a node to describe how cooling devices
> -get assigned to trip points of the zone. The cooling devices are expected
> -to be loaded in the target system.
> -
> -Required properties:
> -- cooling-device:      A list of phandles of cooling devices with their specifiers,
> -  Type: phandle +      referring to which cooling devices are used in this
> -    cooling specifier  binding. In the cooling specifier, the first cell
> -                       is the minimum cooling state and the second cell
> -                       is the maximum cooling state used in this map.
> -- trip:                        A phandle of a trip point node within the same thermal
> -  Type: phandle of     zone.
> -   trip point node
> -
> -Optional property:
> -- contribution:                The cooling contribution to the thermal zone of the
> -  Type: unsigned       referred cooling device at the referred trip point.
> -  Size: one cell       The contribution is a ratio of the sum
> -                       of all cooling contributions within a thermal zone.
> -
> -Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
> -limit specifier means:
> -(i)   - minimum state allowed for minimum cooling state used in the reference.
> -(ii)  - maximum state allowed for maximum cooling state used in the reference.
> -Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
> -
> -* Thermal zone nodes
> -
> -The thermal zone node is the node containing all the required info
> -for describing a thermal zone, including its cooling device bindings. The
> -thermal zone node must contain, apart from its own properties, one sub-node
> -containing trip nodes and one sub-node containing all the zone cooling maps.
> -
> -Required properties:
> -- polling-delay:       The maximum number of milliseconds to wait between polls
> -  Type: unsigned       when checking this thermal zone.
> -  Size: one cell
> -
> -- polling-delay-passive: The maximum number of milliseconds to wait
> -  Type: unsigned       between polls when performing passive cooling.
> -  Size: one cell
> -
> -- thermal-sensors:     A list of thermal sensor phandles and sensor specifier
> -  Type: list of                used while monitoring the thermal zone.
> -  phandles + sensor
> -  specifier
> -
> -- trips:               A sub-node which is a container of only trip point nodes
> -  Type: sub-node       required to describe the thermal zone.
> -
> -Optional property:
> -- cooling-maps:                A sub-node which is a container of only cooling device
> -  Type: sub-node       map nodes, used to describe the relation between trips
> -                       and cooling devices.
> -
> -- coefficients:                An array of integers (one signed cell) containing
> -  Type: array          coefficients to compose a linear relation between
> -  Elem size: one cell  the sensors listed in the thermal-sensors property.
> -  Elem type: signed    Coefficients defaults to 1, in case this property
> -                       is not specified. A simple linear polynomial is used:
> -                       Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
> -
> -                       The coefficients are ordered and they match with sensors
> -                       by means of sensor ID. Additional coefficients are
> -                       interpreted as constant offset.
> -
> -- sustainable-power:   An estimate of the sustainable power (in mW) that the
> -  Type: unsigned       thermal zone can dissipate at the desired
> -  Size: one cell       control temperature.  For reference, the
> -                       sustainable power of a 4'' phone is typically
> -                       2000mW, while on a 10'' tablet is around
> -                       4500mW.
> -
> -Note: The delay properties are bound to the maximum dT/dt (temperature
> -derivative over time) in two situations for a thermal zone:
> -(i)  - when passive cooling is activated (polling-delay-passive); and
> -(ii) - when the zone just needs to be monitored (polling-delay) or
> -when active cooling is activated.
> -
> -The maximum dT/dt is highly bound to hardware power consumption and dissipation
> -capability. The delays should be chosen to account for said max dT/dt,
> -such that a device does not cross several trip boundaries unexpectedly
> -between polls. Choosing the right polling delays shall avoid having the
> -device in temperature ranges that may damage the silicon structures and
> -reduce silicon lifetime.
> -
> -* The thermal-zones node
> -
> -The "thermal-zones" node is a container for all thermal zone nodes. It shall
> -contain only sub-nodes describing thermal zones as in the section
> -"Thermal zone nodes". The "thermal-zones" node appears under "/".
> -
> -* Examples
> -
> -Below are several examples on how to use thermal data descriptors
> -using device tree bindings:
> -
> -(a) - CPU thermal zone
> -
> -The CPU thermal zone example below describes how to setup one thermal zone
> -using one single sensor as temperature source and many cooling devices and
> -power dissipation control sources.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -cpus {
> -       /*
> -        * Here is an example of describing a cooling device for a DVFS
> -        * capable CPU. The CPU node describes its four OPPs.
> -        * The cooling states possible are 0..3, and they are
> -        * used as OPP indexes. The minimum cooling state is 0, which means
> -        * all four OPPs can be available to the system. The maximum
> -        * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V)
> -        * can be available in the system.
> -        */
> -       cpu0: cpu@0 {
> -               ...
> -               operating-points = <
> -                       /* kHz    uV */
> -                       970000  1200000
> -                       792000  1100000
> -                       396000  950000
> -                       198000  850000
> -               >;
> -               #cooling-cells = <2>; /* min followed by max */
> -       };
> -       ...
> -};
> -
> -&i2c1 {
> -       ...
> -       /*
> -        * A simple fan controller which supports 10 speeds of operation
> -        * (represented as 0-9).
> -        */
> -       fan0: fan@48 {
> -               ...
> -               #cooling-cells = <2>; /* min followed by max */
> -       };
> -};
> -
> -ocp {
> -       ...
> -       /*
> -        * A simple IC with a single bandgap temperature sensor.
> -        */
> -       bandgap0: bandgap@0000ed00 {
> -               ...
> -               #thermal-sensor-cells = <0>;
> -       };
> -};
> -
> -thermal-zones {
> -       cpu_thermal: cpu-thermal {
> -               polling-delay-passive = <250>; /* milliseconds */
> -               polling-delay = <1000>; /* milliseconds */
> -
> -               thermal-sensors = <&bandgap0>;
> -
> -               trips {
> -                       cpu_alert0: cpu-alert0 {
> -                               temperature = <90000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "active";
> -                       };
> -                       cpu_alert1: cpu-alert1 {
> -                               temperature = <100000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       };
> -                       cpu_crit: cpu-crit {
> -                               temperature = <125000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "critical";
> -                       };
> -               };
> -
> -               cooling-maps {
> -                       map0 {
> -                               trip = <&cpu_alert0>;
> -                               cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
> -                       };
> -                       map1 {
> -                               trip = <&cpu_alert1>;
> -                               cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> -                       };
> -               };
> -       };
> -};
> -
> -In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is
> -used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
> -device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten
> -different cooling states 0-9. It is used to remove the heat out of
> -the thermal zone 'cpu-thermal' using its cooling states
> -from its minimum to 4, when it reaches trip point 'cpu_alert0'
> -at 90C, as an example of active cooling. The same cooling device is used at
> -'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also
> -linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
> -using all its cooling states at trip point 'cpu_alert1',
> -which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
> -temperature of 125C, represented by the trip point 'cpu_crit', the silicon
> -is not reliable anymore.
> -
> -(b) - IC with several internal sensors
> -
> -The example below describes how to deploy several thermal zones based off a
> -single sensor IC, assuming it has several internal sensors. This is a common
> -case on SoC designs with several internal IPs that may need different thermal
> -requirements, and thus may have their own sensor to monitor or detect internal
> -hotspots in their silicon.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -ocp {
> -       ...
> -       /*
> -        * A simple IC with several bandgap temperature sensors.
> -        */
> -       bandgap0: bandgap@0000ed00 {
> -               ...
> -               #thermal-sensor-cells = <1>;
> -       };
> -};
> -
> -thermal-zones {
> -       cpu_thermal: cpu-thermal {
> -               polling-delay-passive = <250>; /* milliseconds */
> -               polling-delay = <1000>; /* milliseconds */
> -
> -                               /* sensor       ID */
> -               thermal-sensors = <&bandgap0     0>;
> -
> -               trips {
> -                       /* each zone within the SoC may have its own trips */
> -                       cpu_alert: cpu-alert {
> -                               temperature = <100000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       };
> -                       cpu_crit: cpu-crit {
> -                               temperature = <125000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "critical";
> -                       };
> -               };
> -
> -               cooling-maps {
> -                       /* each zone within the SoC may have its own cooling */
> -                       ...
> -               };
> -       };
> -
> -       gpu_thermal: gpu-thermal {
> -               polling-delay-passive = <120>; /* milliseconds */
> -               polling-delay = <1000>; /* milliseconds */
> -
> -                               /* sensor       ID */
> -               thermal-sensors = <&bandgap0     1>;
> -
> -               trips {
> -                       /* each zone within the SoC may have its own trips */
> -                       gpu_alert: gpu-alert {
> -                               temperature = <90000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       };
> -                       gpu_crit: gpu-crit {
> -                               temperature = <105000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "critical";
> -                       };
> -               };
> -
> -               cooling-maps {
> -                       /* each zone within the SoC may have its own cooling */
> -                       ...
> -               };
> -       };
> -
> -       dsp_thermal: dsp-thermal {
> -               polling-delay-passive = <50>; /* milliseconds */
> -               polling-delay = <1000>; /* milliseconds */
> -
> -                               /* sensor       ID */
> -               thermal-sensors = <&bandgap0     2>;
> -
> -               trips {
> -                       /* each zone within the SoC may have its own trips */
> -                       dsp_alert: dsp-alert {
> -                               temperature = <90000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       };
> -                       dsp_crit: gpu-crit {
> -                               temperature = <135000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "critical";
> -                       };
> -               };
> -
> -               cooling-maps {
> -                       /* each zone within the SoC may have its own cooling */
> -                       ...
> -               };
> -       };
> -};
> -
> -In the example above, there is one bandgap IC which has the capability to
> -monitor three sensors. The hardware has been designed so that sensors are
> -placed on different places in the DIE to monitor different temperature
> -hotspots: one for CPU thermal zone, one for GPU thermal zone and the
> -other to monitor a DSP thermal zone.
> -
> -Thus, there is a need to assign each sensor provided by the bandgap IC
> -to different thermal zones. This is achieved by means of using the
> -#thermal-sensor-cells property and using the first cell of the sensor
> -specifier as sensor ID. In the example, then, <bandgap 0> is used to
> -monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal
> -zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone
> -may be uncorrelated, having its own dT/dt requirements, trips
> -and cooling maps.
> -
> -
> -(c) - Several sensors within one single thermal zone
> -
> -The example below illustrates how to use more than one sensor within
> -one thermal zone.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -&i2c1 {
> -       ...
> -       /*
> -        * A simple IC with a single temperature sensor.
> -        */
> -       adc: sensor@49 {
> -               ...
> -               #thermal-sensor-cells = <0>;
> -       };
> -};
> -
> -ocp {
> -       ...
> -       /*
> -        * A simple IC with a single bandgap temperature sensor.
> -        */
> -       bandgap0: bandgap@0000ed00 {
> -               ...
> -               #thermal-sensor-cells = <0>;
> -       };
> -};
> -
> -thermal-zones {
> -       cpu_thermal: cpu-thermal {
> -               polling-delay-passive = <250>; /* milliseconds */
> -               polling-delay = <1000>; /* milliseconds */
> -
> -               thermal-sensors = <&bandgap0>,  /* cpu */
> -                                 <&adc>;       /* pcb north */
> -
> -               /* hotspot = 100 * bandgap - 120 * adc + 484 */
> -               coefficients =          <100    -120    484>;
> -
> -               trips {
> -                       ...
> -               };
> -
> -               cooling-maps {
> -                       ...
> -               };
> -       };
> -};
> -
> -In some cases, there is a need to use more than one sensor to extrapolate
> -a thermal hotspot in the silicon. The above example illustrates this situation.
> -For instance, it may be the case that a sensor external to CPU IP may be placed
> -close to CPU hotspot and together with internal CPU sensor, it is used
> -to determine the hotspot. Assuming this is the case for the above example,
> -the hypothetical extrapolation rule would be:
> -               hotspot = 100 * bandgap - 120 * adc + 484
> -
> -In other context, the same idea can be used to add fixed offset. For instance,
> -consider the hotspot extrapolation rule below:
> -               hotspot = 1 * adc + 6000
> -
> -In the above equation, the hotspot is always 6C higher than what is read
> -from the ADC sensor. The binding would be then:
> -        thermal-sensors =  <&adc>;
> -
> -               /* hotspot = 1 * adc + 6000 */
> -       coefficients =          <1      6000>;
> -
> -(d) - Board thermal
> -
> -The board thermal example below illustrates how to setup one thermal zone
> -with many sensors and many cooling devices.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -&i2c1 {
> -       ...
> -       /*
> -        * An IC with several temperature sensor.
> -        */
> -       adc_dummy: sensor@50 {
> -               ...
> -               #thermal-sensor-cells = <1>; /* sensor internal ID */
> -       };
> -};
> -
> -thermal-zones {
> -       batt-thermal {
> -               polling-delay-passive = <500>; /* milliseconds */
> -               polling-delay = <2500>; /* milliseconds */
> -
> -                               /* sensor       ID */
> -               thermal-sensors = <&adc_dummy     4>;
> -
> -               trips {
> -                       ...
> -               };
> -
> -               cooling-maps {
> -                       ...
> -               };
> -       };
> -
> -       board_thermal: board-thermal {
> -               polling-delay-passive = <1000>; /* milliseconds */
> -               polling-delay = <2500>; /* milliseconds */
> -
> -                               /* sensor       ID */
> -               thermal-sensors = <&adc_dummy     0>, /* pcb top edge */
> -                                 <&adc_dummy     1>, /* lcd */
> -                                 <&adc_dummy     2>; /* back cover */
> -               /*
> -                * An array of coefficients describing the sensor
> -                * linear relation. E.g.:
> -                * z = c1*x1 + c2*x2 + c3*x3
> -                */
> -               coefficients =          <1200   -345    890>;
> -
> -               sustainable-power = <2500>;
> -
> -               trips {
> -                       /* Trips are based on resulting linear equation */
> -                       cpu_trip: cpu-trip {
> -                               temperature = <60000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       };
> -                       gpu_trip: gpu-trip {
> -                               temperature = <55000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       }
> -                       lcd_trip: lcp-trip {
> -                               temperature = <53000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "passive";
> -                       };
> -                       crit_trip: crit-trip {
> -                               temperature = <68000>; /* millicelsius */
> -                               hysteresis = <2000>; /* millicelsius */
> -                               type = "critical";
> -                       };
> -               };
> -
> -               cooling-maps {
> -                       map0 {
> -                               trip = <&cpu_trip>;
> -                               cooling-device = <&cpu0 0 2>;
> -                               contribution = <55>;
> -                       };
> -                       map1 {
> -                               trip = <&gpu_trip>;
> -                               cooling-device = <&gpu0 0 2>;
> -                               contribution = <20>;
> -                       };
> -                       map2 {
> -                               trip = <&lcd_trip>;
> -                               cooling-device = <&lcd0 5 10>;
> -                               contribution = <15>;
> -                       };
> -               };
> -       };
> -};
> -
> -The above example is a mix of previous examples, a sensor IP with several internal
> -sensors used to monitor different zones, one of them is composed by several sensors and
> -with different cooling devices.
> --
> 2.25.1
>
Viresh Kumar July 21, 2020, 3:21 a.m. UTC | #2
On 20-07-20, 17:23, Amit Kucheria wrote:
> Now that we have yaml bindings for the thermal subsystem, get rid of the
> old bindings (thermal.txt).
> 
> Replace all references to thermal.txt in the Documentation with a link
> to the appropriate YAML bindings using the following search and replace
> pattern:
>  - If the reference is specific to the thermal-sensor-cells property,
>  replace with a pointer to thermal-sensor.yaml
>  - If the reference is to the cooling-cells property, replace with a
>  pointer to thermal-cooling-devices.yaml
>  - If the reference is generic thermal bindings, replace with a
>  reference to thermal*.yaml.
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
> Reviewed-by: Rob Herring <robh@kernel.org>
> 
> ---
> Changes since v1:
>  - Rebase onto v.5.8-rc6 to make it apply again
>  - Fix cpufreq/nvidia,tegra20-cpufreq.txt
>  - Fix bindings/arm/freescale/fsl,scu.txt
> 
> 
>  .../bindings/cpufreq/cpufreq-dt.txt           |   3 +-
>  .../bindings/cpufreq/cpufreq-mediatek.txt     |   4 +-
>  .../cpufreq/nvidia,tegra20-cpufreq.txt        |   2 +-

Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Daniel Lezcano July 21, 2020, 8:29 a.m. UTC | #3
On 20/07/2020 13:53, Amit Kucheria wrote:
> Now that we have yaml bindings for the thermal subsystem, get rid of the
> old bindings (thermal.txt).
> 
> Replace all references to thermal.txt in the Documentation with a link
> to the appropriate YAML bindings using the following search and replace
> pattern:
>  - If the reference is specific to the thermal-sensor-cells property,
>  replace with a pointer to thermal-sensor.yaml
>  - If the reference is to the cooling-cells property, replace with a
>  pointer to thermal-cooling-devices.yaml
>  - If the reference is generic thermal bindings, replace with a
>  reference to thermal*.yaml.
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
> Reviewed-by: Rob Herring <robh@kernel.org>

Applied, thanks
diff mbox series

Patch

diff --git a/Documentation/devicetree/bindings/arm/arm,scmi.txt b/Documentation/devicetree/bindings/arm/arm,scmi.txt
index 1f293ea24cd85..55deb68230ebb 100644
--- a/Documentation/devicetree/bindings/arm/arm,scmi.txt
+++ b/Documentation/devicetree/bindings/arm/arm,scmi.txt
@@ -102,7 +102,7 @@  Required sub-node properties:
 [0] http://infocenter.arm.com/help/topic/com.arm.doc.den0056a/index.html
 [1] Documentation/devicetree/bindings/clock/clock-bindings.txt
 [2] Documentation/devicetree/bindings/power/power-domain.yaml
-[3] Documentation/devicetree/bindings/thermal/thermal.txt
+[3] Documentation/devicetree/bindings/thermal/thermal*.yaml
 [4] Documentation/devicetree/bindings/sram/sram.yaml
 [5] Documentation/devicetree/bindings/reset/reset.txt
 
diff --git a/Documentation/devicetree/bindings/arm/arm,scpi.txt b/Documentation/devicetree/bindings/arm/arm,scpi.txt
index dd04d9d9a1b8e..bcd6c3ec471e6 100644
--- a/Documentation/devicetree/bindings/arm/arm,scpi.txt
+++ b/Documentation/devicetree/bindings/arm/arm,scpi.txt
@@ -108,7 +108,7 @@  Required properties:
 
 [0] http://infocenter.arm.com/help/topic/com.arm.doc.dui0922b/index.html
 [1] Documentation/devicetree/bindings/clock/clock-bindings.txt
-[2] Documentation/devicetree/bindings/thermal/thermal.txt
+[2] Documentation/devicetree/bindings/thermal/thermal*.yaml
 [3] Documentation/devicetree/bindings/sram/sram.yaml
 [4] Documentation/devicetree/bindings/power/power-domain.yaml
 
diff --git a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
index 10b8459e49f8c..6064d98b10314 100644
--- a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
+++ b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
@@ -176,7 +176,7 @@  Required properties:
 				  "fsl,imx8qxp-sc-thermal"
 				followed by "fsl,imx-sc-thermal";
 
-- #thermal-sensor-cells:	See Documentation/devicetree/bindings/thermal/thermal.txt
+- #thermal-sensor-cells:	See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
 				for a description.
 
 Example (imx8qxp):
diff --git a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
index 098d932fc9630..e31511255d8e3 100644
--- a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
+++ b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
@@ -111,7 +111,7 @@  Thermal:
 --------
 
 For common binding part and usage, refer to
-Documentation/devicetree/bindings/thermal/thermal.txt
+Documentation/devicetree/bindings/thermal/thermal*.yaml
 
 The thermal IP can probe the temperature all around the processor. It
 may feature several channels, each of them wired to one sensor.
diff --git a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
index f982a8ed93968..a21f7709596c0 100644
--- a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
+++ b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
@@ -203,7 +203,7 @@  It is possible to setup an overheat interrupt by giving at least one
 critical point to any subnode of the thermal-zone node.
 
 For common binding part and usage, refer to
-Documentation/devicetree/bindings/thermal/thermal.txt
+Documentation/devicetree/bindings/thermal/thermal*.yaml
 
 Required properties:
 - compatible: must be one of:
diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
index 332aed8f4597a..56f4423743838 100644
--- a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
+++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
@@ -18,7 +18,8 @@  Optional properties:
   in unit of nanoseconds.
 - voltage-tolerance: Specify the CPU voltage tolerance in percentage.
 - #cooling-cells:
-     Please refer to Documentation/devicetree/bindings/thermal/thermal.txt.
+     Please refer to
+     Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml.
 
 Examples:
 
diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
index 0551c78619de8..ea4994b35207d 100644
--- a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
+++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
@@ -21,8 +21,8 @@  Optional properties:
 	       flow is handled by hardware, hence no software "voltage tracking" is
 	       needed.
 - #cooling-cells:
-	Please refer to Documentation/devicetree/bindings/thermal/thermal.txt
-	for detail.
+	For details, please refer to
+	Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
 
 Example 1 (MT7623 SoC):
 
diff --git a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
index daeca6ae6b769..52a24b82fd864 100644
--- a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
+++ b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
@@ -5,7 +5,7 @@  Required properties:
 - clocks: Must contain an entry for the CPU clock.
   See ../clocks/clock-bindings.txt for details.
 - operating-points-v2: See ../bindings/opp/opp.txt for details.
-- #cooling-cells: Should be 2. See ../thermal/thermal.txt for details.
+- #cooling-cells: Should be 2. See ../thermal/thermal-cooling-devices.yaml for details.
 
 For each opp entry in 'operating-points-v2' table:
 - opp-supported-hw: Two bitfields indicating:
diff --git a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
index 2becdcfdc840c..f4cfa350f6a14 100644
--- a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
+++ b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
@@ -12,7 +12,8 @@  Optional properties:
 - alarm-gpios: This pin going active indicates something is wrong with
   the fan, and a udev event will be fired.
 - #cooling-cells: If used as a cooling device, must be <2>
-  Also see: Documentation/devicetree/bindings/thermal/thermal.txt
+  Also see:
+  Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
   min and max states are derived from the speed-map of the fan.
 
 Note: At least one the "gpios" or "alarm-gpios" properties must be set.
diff --git a/Documentation/devicetree/bindings/hwmon/lm90.txt b/Documentation/devicetree/bindings/hwmon/lm90.txt
index c76a7ac47c342..398dcb9657514 100644
--- a/Documentation/devicetree/bindings/hwmon/lm90.txt
+++ b/Documentation/devicetree/bindings/hwmon/lm90.txt
@@ -34,8 +34,8 @@  Optional properties:
               LM90 "-ALERT" pin output.
               See interrupt-controller/interrupts.txt for the format.
 
-- #thermal-sensor-cells: should be set to 1. See thermal/thermal.txt for
-	      details. See <include/dt-bindings/thermal/lm90.h> for the
+- #thermal-sensor-cells: should be set to 1. See thermal/thermal-sensor.yaml
+	      for details. See <include/dt-bindings/thermal/lm90.h> for the
 	      definition of the local, remote and 2nd remote sensor index
 	      constants.
 
diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
index 87369264feb96..44ba6765697d8 100644
--- a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
+++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
@@ -50,7 +50,7 @@  properties:
   nvmem-cell-names:
     const: calibration
 
-  # See ./thermal.txt for details
+  # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
   "#thermal-sensor-cells":
     enum:
       - 0
diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
index 703979dbd577d..12fc4ef04837f 100644
--- a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
@@ -6,7 +6,7 @@  transaction.
 Required properties:
 - compatible: "amazon,al-thermal".
 - reg: The physical base address and length of the sensor's registers.
-- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Example:
 	thermal: thermal {
diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
index f3e68ed03abf8..1ab5070c751d5 100644
--- a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
+++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
@@ -23,7 +23,7 @@  properties:
   compatible:
     const: brcm,bcm2711-thermal
 
-  # See ./thermal.txt for details
+  # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
   "#thermal-sensor-cells":
     const: 0
 
diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
index da8c5b73ad105..a3e9ec5dc7ac4 100644
--- a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
@@ -7,7 +7,7 @@  compatible: 		should be one of: "brcm,bcm2835-thermal",
 			"brcm,bcm2836-thermal" or "brcm,bcm2837-thermal"
 reg:			Address range of the thermal registers.
 clocks: 		Phandle of the clock used by the thermal sensor.
-#thermal-sensor-cells:	should be 0 (see thermal.txt)
+#thermal-sensor-cells:	should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
 
 Example:
 
diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
index cef716a236f1a..4b19d80e6558b 100644
--- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -9,7 +9,7 @@ 
   by /SOCTHERM/tsensor.
 - clock-names: Input clock name, should be 'thermal_clk'.
 - clocks: phandles for clock specified in "clock-names" property.
-- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Example :
 
diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
index 323a3b3822aac..82ed5d4879666 100644
--- a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
@@ -8,12 +8,12 @@  below threshold level.
 
 Required properties:
 -------------------
-#thermal-sensor-cells:	Please refer <devicetree/bindings/thermal/thermal.txt>
-			for more details.
+#thermal-sensor-cells:	For more details, please refer to
+			<devicetree/bindings/thermal/thermal-sensor.yaml>
 			The value must be 0.
 
 For more details, please refer generic thermal DT binding document
-<devicetree/bindings/thermal/thermal.txt>.
+<devicetree/bindings/thermal/thermal*.yaml>.
 
 Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
 document for the MAX77620.
diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
index f8d7831f39740..1e249c42fae04 100644
--- a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
@@ -23,7 +23,7 @@  Required properties:
 - resets: Reference to the reset controller controlling the thermal controller.
 - mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses
 - mediatek,apmixedsys: A phandle to the APMIXEDSYS controller.
-- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description.
+- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Optional properties:
 - nvmem-cells: A phandle to the calibration data provided by a nvmem device. If
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
index f02f38527a6b6..db880e7ed713e 100644
--- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
@@ -28,9 +28,10 @@  Required properties :
   See ../reset/reset.txt for details.
 - reset-names : Must include the following entries:
   - soctherm
-- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description
-    of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
-    list of valid values when referring to thermal sensors.
+- #thermal-sensor-cells : Should be 1. For a description of this property, see
+     Documentation/devicetree/bindings/thermal/thermal-sensor.yaml.
+    See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values
+    when referring to thermal sensors.
 - throttle-cfgs: A sub-node which is a container of configuration for each
     hardware throttle events. These events can be set as cooling devices.
   * throttle events: Sub-nodes must be named as "light" or "heavy".
@@ -62,7 +63,8 @@  Required properties :
         TEGRA_SOCTHERM_THROT_LEVEL_MED (75%),
         TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%).
       - #cooling-cells: Should be 1. This cooling device only support on/off state.
-        See ./thermal.txt for a description of this property.
+        For a description of this property see:
+	Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
 
       Optional properties: The following properties are T210 specific and
       valid only for OCx throttle events.
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
index e17c07be270b7..fc87f6aa1b8f5 100644
--- a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
@@ -8,7 +8,7 @@  exposed by BPMP.
 The BPMP thermal node must be located directly inside the main BPMP node. See
 ../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding.
 
-This node represents a thermal sensor. See thermal.txt for details of the
+This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the
 core thermal binding.
 
 Required properties:
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
index 0273a92a2a849..2d5b2ad03314b 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
+++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
@@ -8,7 +8,7 @@  Required properties:
 - compatible:      Should contain "qcom,spmi-temp-alarm".
 - reg:             Specifies the SPMI address.
 - interrupts:      PMIC temperature alarm interrupt.
-- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
+- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Optional properties:
 - io-channels:     Should contain IIO channel specifier for the ADC channel,
diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
index c6aac9bcacf1c..7f94669e9ebef 100644
--- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
@@ -24,7 +24,7 @@  Required properties:
 - pinctrl-1 : The "default" pinctrl state, it will be set after reset the
 	      TSADC controller.
 - pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend.
-- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Optional properties:
 - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
index 212198d4b9379..2c918d742867a 100644
--- a/Documentation/devicetree/bindings/thermal/tango-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
@@ -4,7 +4,7 @@  The SMP8758 SoC includes 3 instances of this temperature sensor
 (in the CPU, video decoder, and PCIe controller).
 
 Required properties:
-- #thermal-sensor-cells: Should be 0 (see thermal.txt)
+- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
 - compatible: "sigma,smp8758-thermal"
 - reg: Address range of the thermal registers
 
diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
index 691a09db2fefc..e136946a2f4fd 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
+++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
@@ -8,7 +8,7 @@  temperature using voltage-temperature lookup table.
 Required properties:
 ===================
 - compatible:		     Must be "generic-adc-thermal".
-- #thermal-sensor-cells:     Should be 1. See ./thermal.txt for a description
+- #thermal-sensor-cells:     Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description
 		             of this property.
 Optional properties:
 ===================
diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
deleted file mode 100644
index f78bec19ca358..0000000000000
--- a/Documentation/devicetree/bindings/thermal/thermal.txt
+++ /dev/null
@@ -1,586 +0,0 @@ 
-* Thermal Framework Device Tree descriptor
-
-This file describes a generic binding to provide a way of
-defining hardware thermal structure using device tree.
-A thermal structure includes thermal zones and their components,
-such as trip points, polling intervals, sensors and cooling devices
-binding descriptors.
-
-The target of device tree thermal descriptors is to describe only
-the hardware thermal aspects. The thermal device tree bindings are
-not about how the system must control or which algorithm or policy
-must be taken in place.
-
-There are five types of nodes involved to describe thermal bindings:
-- thermal sensors: devices which may be used to take temperature
-  measurements.
-- cooling devices: devices which may be used to dissipate heat.
-- trip points: describe key temperatures at which cooling is recommended. The
-  set of points should be chosen based on hardware limits.
-- cooling maps: used to describe links between trip points and cooling devices;
-- thermal zones: used to describe thermal data within the hardware;
-
-The following is a description of each of these node types.
-
-* Thermal sensor devices
-
-Thermal sensor devices are nodes providing temperature sensing capabilities on
-thermal zones. Typical devices are I2C ADC converters and bandgaps. These are
-nodes providing temperature data to thermal zones. Thermal sensor devices may
-control one or more internal sensors.
-
-Required property:
-- #thermal-sensor-cells: Used to provide sensor device specific information
-  Type: unsigned	 while referring to it. Typically 0 on thermal sensor
-  Size: one cell	 nodes with only one sensor, and at least 1 on nodes
-			 with several internal sensors, in order
-			 to identify uniquely the sensor instances within
-			 the IC. See thermal zone binding for more details
-			 on how consumers refer to sensor devices.
-
-* Cooling device nodes
-
-Cooling devices are nodes providing control on power dissipation. There
-are essentially two ways to provide control on power dissipation. First
-is by means of regulating device performance, which is known as passive
-cooling. A typical passive cooling is a CPU that has dynamic voltage and
-frequency scaling (DVFS), and uses lower frequencies as cooling states.
-Second is by means of activating devices in order to remove
-the dissipated heat, which is known as active cooling, e.g. regulating
-fan speeds. In both cases, cooling devices shall have a way to determine
-the state of cooling in which the device is.
-
-Any cooling device has a range of cooling states (i.e. different levels
-of heat dissipation). For example a fan's cooling states correspond to
-the different fan speeds possible. Cooling states are referred to by
-single unsigned integers, where larger numbers mean greater heat
-dissipation. The precise set of cooling states associated with a device
-should be defined in a particular device's binding.
-For more examples of cooling devices, refer to the example sections below.
-
-Required properties:
-- #cooling-cells:	Used to provide cooling device specific information
-  Type: unsigned	while referring to it. Must be at least 2, in order
-  Size: one cell	to specify minimum and maximum cooling state used
-			in the reference. The first cell is the minimum
-			cooling state requested and the second cell is
-			the maximum cooling state requested in the reference.
-			See Cooling device maps section below for more details
-			on how consumers refer to cooling devices.
-
-* Trip points
-
-The trip node is a node to describe a point in the temperature domain
-in which the system takes an action. This node describes just the point,
-not the action.
-
-Required properties:
-- temperature:		An integer indicating the trip temperature level,
-  Type: signed		in millicelsius.
-  Size: one cell
-
-- hysteresis:		A low hysteresis value on temperature property (above).
-  Type: unsigned	This is a relative value, in millicelsius.
-  Size: one cell
-
-- type:			a string containing the trip type. Expected values are:
-	"active":	A trip point to enable active cooling
-	"passive":	A trip point to enable passive cooling
-	"hot":		A trip point to notify emergency
-	"critical":	Hardware not reliable.
-  Type: string
-
-* Cooling device maps
-
-The cooling device maps node is a node to describe how cooling devices
-get assigned to trip points of the zone. The cooling devices are expected
-to be loaded in the target system.
-
-Required properties:
-- cooling-device:	A list of phandles of cooling devices with their specifiers,
-  Type: phandle +	referring to which cooling devices are used in this
-    cooling specifier	binding. In the cooling specifier, the first cell
-			is the minimum cooling state and the second cell
-			is the maximum cooling state used in this map.
-- trip:			A phandle of a trip point node within the same thermal
-  Type: phandle of	zone.
-   trip point node
-
-Optional property:
-- contribution:		The cooling contribution to the thermal zone of the
-  Type: unsigned	referred cooling device at the referred trip point.
-  Size: one cell	The contribution is a ratio of the sum
-			of all cooling contributions within a thermal zone.
-
-Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
-limit specifier means:
-(i)   - minimum state allowed for minimum cooling state used in the reference.
-(ii)  - maximum state allowed for maximum cooling state used in the reference.
-Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
-
-* Thermal zone nodes
-
-The thermal zone node is the node containing all the required info
-for describing a thermal zone, including its cooling device bindings. The
-thermal zone node must contain, apart from its own properties, one sub-node
-containing trip nodes and one sub-node containing all the zone cooling maps.
-
-Required properties:
-- polling-delay:	The maximum number of milliseconds to wait between polls
-  Type: unsigned	when checking this thermal zone.
-  Size: one cell
-
-- polling-delay-passive: The maximum number of milliseconds to wait
-  Type: unsigned	between polls when performing passive cooling.
-  Size: one cell
-
-- thermal-sensors:	A list of thermal sensor phandles and sensor specifier
-  Type: list of		used while monitoring the thermal zone.
-  phandles + sensor
-  specifier
-
-- trips:		A sub-node which is a container of only trip point nodes
-  Type: sub-node	required to describe the thermal zone.
-
-Optional property:
-- cooling-maps:		A sub-node which is a container of only cooling device
-  Type: sub-node	map nodes, used to describe the relation between trips
-			and cooling devices.
-
-- coefficients:		An array of integers (one signed cell) containing
-  Type: array		coefficients to compose a linear relation between
-  Elem size: one cell	the sensors listed in the thermal-sensors property.
-  Elem type: signed	Coefficients defaults to 1, in case this property
-			is not specified. A simple linear polynomial is used:
-			Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
-
-			The coefficients are ordered and they match with sensors
-			by means of sensor ID. Additional coefficients are
-			interpreted as constant offset.
-
-- sustainable-power:	An estimate of the sustainable power (in mW) that the
-  Type: unsigned	thermal zone can dissipate at the desired
-  Size: one cell	control temperature.  For reference, the
-			sustainable power of a 4'' phone is typically
-			2000mW, while on a 10'' tablet is around
-			4500mW.
-
-Note: The delay properties are bound to the maximum dT/dt (temperature
-derivative over time) in two situations for a thermal zone:
-(i)  - when passive cooling is activated (polling-delay-passive); and
-(ii) - when the zone just needs to be monitored (polling-delay) or
-when active cooling is activated.
-
-The maximum dT/dt is highly bound to hardware power consumption and dissipation
-capability. The delays should be chosen to account for said max dT/dt,
-such that a device does not cross several trip boundaries unexpectedly
-between polls. Choosing the right polling delays shall avoid having the
-device in temperature ranges that may damage the silicon structures and
-reduce silicon lifetime.
-
-* The thermal-zones node
-
-The "thermal-zones" node is a container for all thermal zone nodes. It shall
-contain only sub-nodes describing thermal zones as in the section
-"Thermal zone nodes". The "thermal-zones" node appears under "/".
-
-* Examples
-
-Below are several examples on how to use thermal data descriptors
-using device tree bindings:
-
-(a) - CPU thermal zone
-
-The CPU thermal zone example below describes how to setup one thermal zone
-using one single sensor as temperature source and many cooling devices and
-power dissipation control sources.
-
-#include <dt-bindings/thermal/thermal.h>
-
-cpus {
-	/*
-	 * Here is an example of describing a cooling device for a DVFS
-	 * capable CPU. The CPU node describes its four OPPs.
-	 * The cooling states possible are 0..3, and they are
-	 * used as OPP indexes. The minimum cooling state is 0, which means
-	 * all four OPPs can be available to the system. The maximum
-	 * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V)
-	 * can be available in the system.
-	 */
-	cpu0: cpu@0 {
-		...
-		operating-points = <
-			/* kHz    uV */
-			970000  1200000
-			792000  1100000
-			396000  950000
-			198000  850000
-		>;
-		#cooling-cells = <2>; /* min followed by max */
-	};
-	...
-};
-
-&i2c1 {
-	...
-	/*
-	 * A simple fan controller which supports 10 speeds of operation
-	 * (represented as 0-9).
-	 */
-	fan0: fan@48 {
-		...
-		#cooling-cells = <2>; /* min followed by max */
-	};
-};
-
-ocp {
-	...
-	/*
-	 * A simple IC with a single bandgap temperature sensor.
-	 */
-	bandgap0: bandgap@0000ed00 {
-		...
-		#thermal-sensor-cells = <0>;
-	};
-};
-
-thermal-zones {
-	cpu_thermal: cpu-thermal {
-		polling-delay-passive = <250>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-		thermal-sensors = <&bandgap0>;
-
-		trips {
-			cpu_alert0: cpu-alert0 {
-				temperature = <90000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "active";
-			};
-			cpu_alert1: cpu-alert1 {
-				temperature = <100000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			cpu_crit: cpu-crit {
-				temperature = <125000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			map0 {
-				trip = <&cpu_alert0>;
-				cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
-			};
-			map1 {
-				trip = <&cpu_alert1>;
-				cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
-			};
-		};
-	};
-};
-
-In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is
-used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
-device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten
-different cooling states 0-9. It is used to remove the heat out of
-the thermal zone 'cpu-thermal' using its cooling states
-from its minimum to 4, when it reaches trip point 'cpu_alert0'
-at 90C, as an example of active cooling. The same cooling device is used at
-'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also
-linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
-using all its cooling states at trip point 'cpu_alert1',
-which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
-temperature of 125C, represented by the trip point 'cpu_crit', the silicon
-is not reliable anymore.
-
-(b) - IC with several internal sensors
-
-The example below describes how to deploy several thermal zones based off a
-single sensor IC, assuming it has several internal sensors. This is a common
-case on SoC designs with several internal IPs that may need different thermal
-requirements, and thus may have their own sensor to monitor or detect internal
-hotspots in their silicon.
-
-#include <dt-bindings/thermal/thermal.h>
-
-ocp {
-	...
-	/*
-	 * A simple IC with several bandgap temperature sensors.
-	 */
-	bandgap0: bandgap@0000ed00 {
-		...
-		#thermal-sensor-cells = <1>;
-	};
-};
-
-thermal-zones {
-	cpu_thermal: cpu-thermal {
-		polling-delay-passive = <250>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&bandgap0     0>;
-
-		trips {
-			/* each zone within the SoC may have its own trips */
-			cpu_alert: cpu-alert {
-				temperature = <100000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			cpu_crit: cpu-crit {
-				temperature = <125000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			/* each zone within the SoC may have its own cooling */
-			...
-		};
-	};
-
-	gpu_thermal: gpu-thermal {
-		polling-delay-passive = <120>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&bandgap0     1>;
-
-		trips {
-			/* each zone within the SoC may have its own trips */
-			gpu_alert: gpu-alert {
-				temperature = <90000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			gpu_crit: gpu-crit {
-				temperature = <105000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			/* each zone within the SoC may have its own cooling */
-			...
-		};
-	};
-
-	dsp_thermal: dsp-thermal {
-		polling-delay-passive = <50>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&bandgap0     2>;
-
-		trips {
-			/* each zone within the SoC may have its own trips */
-			dsp_alert: dsp-alert {
-				temperature = <90000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			dsp_crit: gpu-crit {
-				temperature = <135000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			/* each zone within the SoC may have its own cooling */
-			...
-		};
-	};
-};
-
-In the example above, there is one bandgap IC which has the capability to
-monitor three sensors. The hardware has been designed so that sensors are
-placed on different places in the DIE to monitor different temperature
-hotspots: one for CPU thermal zone, one for GPU thermal zone and the
-other to monitor a DSP thermal zone.
-
-Thus, there is a need to assign each sensor provided by the bandgap IC
-to different thermal zones. This is achieved by means of using the
-#thermal-sensor-cells property and using the first cell of the sensor
-specifier as sensor ID. In the example, then, <bandgap 0> is used to
-monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal
-zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone
-may be uncorrelated, having its own dT/dt requirements, trips
-and cooling maps.
-
-
-(c) - Several sensors within one single thermal zone
-
-The example below illustrates how to use more than one sensor within
-one thermal zone.
-
-#include <dt-bindings/thermal/thermal.h>
-
-&i2c1 {
-	...
-	/*
-	 * A simple IC with a single temperature sensor.
-	 */
-	adc: sensor@49 {
-		...
-		#thermal-sensor-cells = <0>;
-	};
-};
-
-ocp {
-	...
-	/*
-	 * A simple IC with a single bandgap temperature sensor.
-	 */
-	bandgap0: bandgap@0000ed00 {
-		...
-		#thermal-sensor-cells = <0>;
-	};
-};
-
-thermal-zones {
-	cpu_thermal: cpu-thermal {
-		polling-delay-passive = <250>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-		thermal-sensors = <&bandgap0>,	/* cpu */
-				  <&adc>;	/* pcb north */
-
-		/* hotspot = 100 * bandgap - 120 * adc + 484 */
-		coefficients =		<100	-120	484>;
-
-		trips {
-			...
-		};
-
-		cooling-maps {
-			...
-		};
-	};
-};
-
-In some cases, there is a need to use more than one sensor to extrapolate
-a thermal hotspot in the silicon. The above example illustrates this situation.
-For instance, it may be the case that a sensor external to CPU IP may be placed
-close to CPU hotspot and together with internal CPU sensor, it is used
-to determine the hotspot. Assuming this is the case for the above example,
-the hypothetical extrapolation rule would be:
-		hotspot = 100 * bandgap - 120 * adc + 484
-
-In other context, the same idea can be used to add fixed offset. For instance,
-consider the hotspot extrapolation rule below:
-		hotspot = 1 * adc + 6000
-
-In the above equation, the hotspot is always 6C higher than what is read
-from the ADC sensor. The binding would be then:
-        thermal-sensors =  <&adc>;
-
-		/* hotspot = 1 * adc + 6000 */
-	coefficients =		<1	6000>;
-
-(d) - Board thermal
-
-The board thermal example below illustrates how to setup one thermal zone
-with many sensors and many cooling devices.
-
-#include <dt-bindings/thermal/thermal.h>
-
-&i2c1 {
-	...
-	/*
-	 * An IC with several temperature sensor.
-	 */
-	adc_dummy: sensor@50 {
-		...
-		#thermal-sensor-cells = <1>; /* sensor internal ID */
-	};
-};
-
-thermal-zones {
-	batt-thermal {
-		polling-delay-passive = <500>; /* milliseconds */
-		polling-delay = <2500>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&adc_dummy     4>;
-
-		trips {
-			...
-		};
-
-		cooling-maps {
-			...
-		};
-	};
-
-	board_thermal: board-thermal {
-		polling-delay-passive = <1000>; /* milliseconds */
-		polling-delay = <2500>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&adc_dummy     0>, /* pcb top edge */
-				  <&adc_dummy     1>, /* lcd */
-				  <&adc_dummy     2>; /* back cover */
-		/*
-		 * An array of coefficients describing the sensor
-		 * linear relation. E.g.:
-		 * z = c1*x1 + c2*x2 + c3*x3
-		 */
-		coefficients =		<1200	-345	890>;
-
-		sustainable-power = <2500>;
-
-		trips {
-			/* Trips are based on resulting linear equation */
-			cpu_trip: cpu-trip {
-				temperature = <60000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			gpu_trip: gpu-trip {
-				temperature = <55000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			}
-			lcd_trip: lcp-trip {
-				temperature = <53000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			crit_trip: crit-trip {
-				temperature = <68000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			map0 {
-				trip = <&cpu_trip>;
-				cooling-device = <&cpu0 0 2>;
-				contribution = <55>;
-			};
-			map1 {
-				trip = <&gpu_trip>;
-				cooling-device = <&gpu0 0 2>;
-				contribution = <20>;
-			};
-			map2 {
-				trip = <&lcd_trip>;
-				cooling-device = <&lcd0 5 10>;
-				contribution = <15>;
-			};
-		};
-	};
-};
-
-The above example is a mix of previous examples, a sensor IP with several internal
-sensors used to monitor different zones, one of them is composed by several sensors and
-with different cooling devices.