| Message ID | 20200308163230.4002-2-afaerber@suse.de |
|---|---|
| State | RFC, archived |
| Headers | show |
| Series | ARM: Initial Sunplus Plus1 SP7021 and BPI-F2S support | expand |
| Context | Check | Description |
|---|---|---|
| robh/checkpatch | success | |
| robh/dt-meta-schema | fail | build log |
| robh/checkpatch | success | |
| robh/dt-meta-schema | success |
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml index 6e09fc7362d5..2c764b0941b4 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml @@ -955,6 +955,8 @@ patternProperties: description: Summit microelectronics "^sunchip,.*": description: Shenzhen Sunchip Technology Co., Ltd + "^sunplus,.*": + description: Sunplus Technology Co., Ltd. "^SUNW,.*": description: Sun Microsystems, Inc "^swir,.*":
Sunplus Technology Co., Ltd. is a Taiwanese IC vendor. Assign vendor prefix "sunplus". Cc: Wells Lu 呂芳騰 <wells.lu@sunplus.com> Signed-off-by: Andreas Färber <afaerber@suse.de> --- Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++ 1 file changed, 2 insertions(+)