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[GIT,PULL] arm64: dts: hisilicon dts updates for v4.19

Message ID 5B4F6398.2070608@hisilicon.com
State New
Headers show
Series [GIT,PULL] arm64: dts: hisilicon dts updates for v4.19 | expand

Pull-request

git://github.com/hisilicon/linux-hisi.git tags/hisi-arm64-dt-for-4.19

Message

Wei Xu July 18, 2018, 3:58 p.m. UTC 
Hi Olof, Hi Arnd,

Please consider to pull the following changes.
I rebased the pull on hisi-fixes-for-4.18 since there are
some fixes for v4.18 have been merged.

Thanks!

Best Regards,
Wei

---
The following changes since commit a30449eb3ac908f26b4bc963a58039a5f2725ffa:

  arm64: dts: hikey960: Define wl1837 power capabilities (2018-06-28 17:07:44 +0100)

are available in the Git repository at:

  git://github.com/hisilicon/linux-hisi.git tags/hisi-arm64-dt-for-4.19

for you to fetch changes up to 168124aa0b430dce963d9a9e3dba44cb81a8159e:

  arm64: dts: hi6220: Add all CPUs in cooling maps (2018-07-17 13:58:17 +0100)

----------------------------------------------------------------
ARM64: DT: Hisilicon SoC DT updates for 4.19

- Tidy up MMC properties for hi3660
- Remove keep-power-in-suspend on hikey and hikey960 to
  avoid keeping wifi power during suspend and let the
  user enable it if required
- Update idle states for hikey960
- Add missing cooling device properties for cpus on hi6220
- Update thermal dt binding to allow multiple devices
  to share cooling map
- Add all cpus in the cooling maps for hi6220

----------------------------------------------------------------
Vincent Guittot (1):
      arm64: hikey960: update idle-states

Viresh Kumar (3):
      arm64: dts: hisilicon: Add missing cooling device properties for CPUs
      dt-bindings: thermal: Allow multiple devices to share cooling map
      arm64: dts: hi6220: Add all CPUs in cooling maps

oscardagrach (4):
      arm64: dts: hikey960: Remove deprecated MMC properties
      arm64: dts: hikey960: Clean up MMC properties and move to proper file
      arm64: dts: hikey960: Remove keep-power-in-suspend property
      arm64: dts: hikey: Remove keep-power-in-suspend property

 .../devicetree/bindings/thermal/thermal.txt        | 11 +--
 arch/arm64/boot/dts/hisilicon/hi3660-hikey960.dts  | 26 +++++--
 arch/arm64/boot/dts/hisilicon/hi3660.dtsi          | 79 +++++++++-------------
 arch/arm64/boot/dts/hisilicon/hi6220-hikey.dts     |  1 -
 arch/arm64/boot/dts/hisilicon/hi6220.dtsi          | 25 ++++++-
 5 files changed, 78 insertions(+), 64 deletions(-)

Comments

Wei Xu July 19, 2018, 9:52 a.m. UTC | #1 
Hi Olof, Hi Arnd,

Please ignore this pull request since Viresh expected the thermal
binding patch is going via the thermal core maintainers.
I will send v2 and drop those 2 patches.

Sorry for the noise!

Best Regards,
Wei

On 2018/7/18 16:58, Wei Xu wrote:
> Hi Olof, Hi Arnd,
> 
> Please consider to pull the following changes.
> I rebased the pull on hisi-fixes-for-4.18 since there are
> some fixes for v4.18 have been merged.
> 
> Thanks!
> 
> Best Regards,
> Wei
> 
> ---
> The following changes since commit a30449eb3ac908f26b4bc963a58039a5f2725ffa:
> 
>   arm64: dts: hikey960: Define wl1837 power capabilities (2018-06-28 17:07:44 +0100)
> 
> are available in the Git repository at:
> 
>   git://github.com/hisilicon/linux-hisi.git tags/hisi-arm64-dt-for-4.19
> 
> for you to fetch changes up to 168124aa0b430dce963d9a9e3dba44cb81a8159e:
> 
>   arm64: dts: hi6220: Add all CPUs in cooling maps (2018-07-17 13:58:17 +0100)
> 
> ----------------------------------------------------------------
> ARM64: DT: Hisilicon SoC DT updates for 4.19
> 
> - Tidy up MMC properties for hi3660
> - Remove keep-power-in-suspend on hikey and hikey960 to
>   avoid keeping wifi power during suspend and let the
>   user enable it if required
> - Update idle states for hikey960
> - Add missing cooling device properties for cpus on hi6220
> - Update thermal dt binding to allow multiple devices
>   to share cooling map
> - Add all cpus in the cooling maps for hi6220
> 
> ----------------------------------------------------------------
> Vincent Guittot (1):
>       arm64: hikey960: update idle-states
> 
> Viresh Kumar (3):
>       arm64: dts: hisilicon: Add missing cooling device properties for CPUs
>       dt-bindings: thermal: Allow multiple devices to share cooling map
>       arm64: dts: hi6220: Add all CPUs in cooling maps
> 
> oscardagrach (4):
>       arm64: dts: hikey960: Remove deprecated MMC properties
>       arm64: dts: hikey960: Clean up MMC properties and move to proper file
>       arm64: dts: hikey960: Remove keep-power-in-suspend property
>       arm64: dts: hikey: Remove keep-power-in-suspend property
> 
>  .../devicetree/bindings/thermal/thermal.txt        | 11 +--
>  arch/arm64/boot/dts/hisilicon/hi3660-hikey960.dts  | 26 +++++--
>  arch/arm64/boot/dts/hisilicon/hi3660.dtsi          | 79 +++++++++-------------
>  arch/arm64/boot/dts/hisilicon/hi6220-hikey.dts     |  1 -
>  arch/arm64/boot/dts/hisilicon/hi6220.dtsi          | 25 ++++++-
>  5 files changed, 78 insertions(+), 64 deletions(-)
> 
>