From patchwork Thu Aug 10 08:32:13 2017 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: "Wangtao (Kevin, Kirin)" X-Patchwork-Id: 800129 Return-Path: X-Original-To: incoming-dt@patchwork.ozlabs.org Delivered-To: patchwork-incoming-dt@bilbo.ozlabs.org Authentication-Results: ozlabs.org; spf=none (mailfrom) smtp.mailfrom=vger.kernel.org (client-ip=209.132.180.67; helo=vger.kernel.org; envelope-from=devicetree-owner@vger.kernel.org; receiver=) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by ozlabs.org (Postfix) with ESMTP id 3xShSQ3vhYz9s0g for ; Thu, 10 Aug 2017 18:41:26 +1000 (AEST) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1752253AbdHJIkS (ORCPT ); Thu, 10 Aug 2017 04:40:18 -0400 Received: from szxga05-in.huawei.com ([45.249.212.191]:3043 "EHLO szxga05-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751456AbdHJIiM (ORCPT ); Thu, 10 Aug 2017 04:38:12 -0400 Received: from 172.30.72.60 (EHLO DGGEMS409-HUB.china.huawei.com) ([172.30.72.60]) by dggrg05-dlp.huawei.com (MOS 4.4.6-GA FastPath queued) with ESMTP id DEX89438; Thu, 10 Aug 2017 16:38:06 +0800 (CST) Received: from HSH1000038028.huawei.com (10.177.161.152) by DGGEMS409-HUB.china.huawei.com (10.3.19.209) with Microsoft SMTP Server id 14.3.301.0; Thu, 10 Aug 2017 16:37:54 +0800 From: Tao Wang To: , , , , , , CC: , , , , , , Subject: [PATCH v3 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Date: Thu, 10 Aug 2017 16:32:13 +0800 Message-ID: <1502353935-92924-2-git-send-email-kevin.wangtao@hisilicon.com> X-Mailer: git-send-email 2.8.1 In-Reply-To: <1502353935-92924-1-git-send-email-kevin.wangtao@hisilicon.com> References: <1498102923-68481-1-git-send-email-kevin.wangtao@hisilicon.com> <1502353935-92924-1-git-send-email-kevin.wangtao@hisilicon.com> MIME-Version: 1.0 X-Originating-IP: [10.177.161.152] X-CFilter-Loop: Reflected X-Mirapoint-Virus-RAPID-Raw: score=unknown(0), refid=str=0001.0A020206.598C1B6F.0031, ss=1, re=0.000, recu=0.000, reip=0.000, cl=1, cld=1, fgs=0, ip=0.0.0.0, so=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32 X-Mirapoint-Loop-Id: f414162281d88b15f494ec99dba0a1c3 Sender: devicetree-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: devicetree@vger.kernel.org From: Tao Wang This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 23 ++++++++++++++++++++++ 1 file changed, 23 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt new file mode 100644 index 0000000..2ab0eb9 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt @@ -0,0 +1,23 @@ +* Temperature Sensor on hisilicon SoC + +** Required properties : + +- compatible: "hisilicon,thermal-tsensor". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- offset: reg offset of each sensor. +- coefficients: An array of integers (one signed cell) containing + coefficients to turn adc value to temperture. +- hisi,adc-range: adc value range, minimum value is followed by maximum value. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + +tsensor: tsensor@FFF3000 { + compatible = "hisilicon,tsensor"; + reg = <0x0 0xfff30000 0x0 0x1000>; + offset = <0x1c 0x5c 0x9c>; + coefficients = <165000 (-40000)>; + hisi,adc-range = <0x74 0x39A>; + #thermal-sensor-cells = <1>; +};