[v2,1/3] dt-bindings: Document the hi3660 thermal sensor bindings

This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
---
Changes in v2:
- remove redundant property

 .../devicetree/bindings/thermal/hi3660-thermal.txt |   16 ++++++++++++++++
 1 file changed, 16 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt

Hey Tao,

On Thu, Jun 22, 2017 at 11:42:02AM +0800, Tao Wang wrote:
> This patch adds the support for thermal sensor of Hi3660 SoC.
> this will register sensors for thermal framework and use device
> tree to bind cooling device.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> ---
> Changes in v2:
> - correct alphabet order
> - correct compatible name
> 
>  drivers/thermal/Kconfig          |   10 ++
>  drivers/thermal/Makefile         |    1 +
>  drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
>  3 files changed, 209 insertions(+)
>  create mode 100644 drivers/thermal/hi3660_thermal.c
> 
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index b5b5fac..ed22a90 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -192,6 +192,16 @@ config THERMAL_EMULATION
>  	  because userland can easily disable the thermal policy by simply
>  	  flooding this sysfs node with low temperature values.
>  
> +config HI3660_THERMAL
> +	tristate "Hi3660 thermal driver"
> +	depends on ARCH_HISI || COMPILE_TEST
> +	depends on HAS_IOMEM
> +	depends on OF
> +	default y
> +	help
> +	  Enable this to plug Hi3660 thermal driver into the Linux thermal
> +	  framework.
> +
>  config HISI_THERMAL
>  	tristate "Hisilicon thermal driver"
>  	depends on ARCH_HISI || COMPILE_TEST
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 094d703..f29d0a5 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
>  obj-$(CONFIG_ST_THERMAL)	+= st/
>  obj-$(CONFIG_QCOM_TSENS)	+= qcom/
>  obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
> +obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
>  obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
>  obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
>  obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
> new file mode 100644
> index 0000000..68fa9018
> --- /dev/null
> +++ b/drivers/thermal/hi3660_thermal.c
> @@ -0,0 +1,198 @@
> +/*
> + *  linux/drivers/thermal/hi3660_thermal.c
> + *
> + *  Copyright (c) 2017 Hisilicon Limited.
> + *  Copyright (c) 2017 Linaro Limited.
> + *
> + *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
> + *  Author: Leo Yan <leo.yan@linaro.org>
> + *
> + *  This program is free software; you can redistribute it and/or modify
> + *  it under the terms of the GNU General Public License as published by
> + *  the Free Software Foundation; version 2 of the License.
> + *
> + *  This program is distributed in the hope that it will be useful,
> + *  but WITHOUT ANY WARRANTY; without even the implied warranty of
> + *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
> + *  GNU General Public License for more details.
> + *
> + *  You should have received a copy of the GNU General Public License
> + *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
> + */
> +
> +#include <linux/clk.h>
> +#include <linux/device.h>
> +#include <linux/err.h>
> +#include <linux/io.h>
> +#include <linux/kernel.h>
> +#include <linux/of.h>
> +#include <linux/module.h>
> +#include <linux/platform_device.h>
> +#include <linux/thermal.h>
> +
> +#include "thermal_core.h"
> +
> +#define HW_MAX_SENSORS			4
> +#define HISI_MAX_SENSORS		6
> +#define SENSOR_MAX			4
> +#define SENSOR_AVG			5
> +
> +#define ADC_MIN		116
> +#define ADC_MAX		922
> +
> +/* hi3660 Thermal Sensor Dev Structure */
> +struct hi3660_thermal_sensor {
> +	struct hi3660_thermal_data *thermal;
> +	struct thermal_zone_device *tzd;
> +
> +	uint32_t id;
> +};
> +
> +struct hi3660_thermal_data {
> +	struct platform_device *pdev;
> +	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
> +	void __iomem *thermal_base;
> +};
> +
> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
> +
> +
> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
> +{
> +	struct hi3660_thermal_sensor *sensor = _sensor;
> +	struct hi3660_thermal_data *data = sensor->thermal;
> +	unsigned int idx;
> +	int val, average = 0, max = 0;
> +
> +	if (sensor->id < HW_MAX_SENSORS) {
> +		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
> +		val = clamp_val(val, ADC_MIN, ADC_MAX);
> +	} else {
> +		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
> +			val = readl(data->thermal_base
> +					+ sensor_reg_offset[idx]);
> +			val = clamp_val(val, ADC_MIN, ADC_MAX);
> +			average += val;
> +			if (val > max)
> +				max = val;
> +		}
> +
> +		if (sensor->id == SENSOR_MAX)
> +			val = max;
> +		else if (sensor->id == SENSOR_AVG)
> +			val = average / HW_MAX_SENSORS;
> +	}
> +
> +	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;

Where do these constants come from (165000 and 40000) can these some how
be rearranged and described in DT (coefficients) and using the offset and slope fields?

> +
> +	return 0;
> +}
> +
> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
> +	.get_temp = hi3660_thermal_get_temp,
> +};
> +
> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
> +		struct hi3660_thermal_data *data,
> +		struct hi3660_thermal_sensor *sensor,
> +		int index)
> +{
> +	int ret = 0;
> +
> +	sensor->id = index;
> +	sensor->thermal = data;
> +
> +	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
> +				sensor->id, sensor, &hi3660_of_thermal_ops);
> +	if (IS_ERR(sensor->tzd)) {
> +		ret = PTR_ERR(sensor->tzd);
> +		sensor->tzd = NULL;
> +	}
> +
> +	return ret;
> +}
> +
> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
> +				       bool on)
> +{
> +	struct thermal_zone_device *tzd = sensor->tzd;
> +
> +	tzd->ops->set_mode(tzd,
> +		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
> +}
> +
> +static int hi3660_thermal_probe(struct platform_device *pdev)
> +{
> +	struct device *dev = &pdev->dev;
> +	struct hi3660_thermal_data *data;
> +	struct resource *res;
> +	int ret = 0;
> +	int i;
> +
> +	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
> +	if (!data)
> +		return -ENOMEM;
> +
> +	data->pdev = pdev;
> +	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
> +	data->thermal_base = devm_ioremap_resource(dev, res);
> +	if (IS_ERR(data->thermal_base)) {
> +		dev_err(dev, "failed get reg base\n");
> +		return -ENOMEM;
> +	}
> +
> +	platform_set_drvdata(pdev, data);
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
> +		ret = hi3660_thermal_register_sensor(pdev, data,
> +						     &data->sensors[i], i);
> +		if (ret)
> +			dev_err(&pdev->dev,
> +				"failed to register thermal sensor%d: %d\n",
> +				i, ret);

Do you really want to continue if some of the sensors fail to register?

> +		else
> +			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
> +	}
> +
> +	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");

Do you really need the above info in the kernel log?

> +	return 0;
> +}
> +
> +static int hi3660_thermal_exit(struct platform_device *pdev)
> +{
> +	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
> +	int i;
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; i++) {
> +		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
> +
> +		if (!sensor->tzd)
> +			continue;

Why are you considering a valid case of not registering all expected
sensors?
> +
> +		hi3660_thermal_toggle_sensor(sensor, false);
> +	}
> +
> +	return 0;
> +}
> +
> +static const struct of_device_id hi3660_thermal_id_table[] = {
> +	{ .compatible = "hisilicon,hi3660-thermal" },
> +	{}
> +};
> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
> +
> +static struct platform_driver hi3660_thermal_driver = {
> +	.probe = hi3660_thermal_probe,
> +	.remove = hi3660_thermal_exit,
> +	.driver = {
> +		.name = "hi3660_thermal",
> +		.of_match_table = hi3660_thermal_id_table,
> +	},
> +};
> +
> +module_platform_driver(hi3660_thermal_driver);
> +
> +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
> +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
> +MODULE_DESCRIPTION("hi3660 thermal driver");
> +MODULE_LICENSE("GPL v2");
> -- 
> 1.7.9.5
> 
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On Thu, Jun 22, 2017 at 11:42:01AM +0800, Tao Wang wrote:
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> ---
> Changes in v2:
> - remove redundant property
> 
>  .../devicetree/bindings/thermal/hi3660-thermal.txt |   16 ++++++++++++++++
>  1 file changed, 16 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> new file mode 100644
> index 0000000..f3dddcf
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> @@ -0,0 +1,16 @@
> +* Temperature Sensor on hisilicon hi3660 SoC
> +

Would you mind add some more description of the sensors/where to find
further hardware documentation?

> +** Required properties :
> +
> +- compatible: "hisilicon,thermal-hi3660".
> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +Example :
> +
> +	tsensor: tsensor {
> +		compatible = "hisilicon,thermal-hi3660";
> +		reg = <0x0 0xfff30000 0x0 0x1000>;
> +		#thermal-sensor-cells = <1>;
> +	 };
> -- 
> 1.7.9.5
> 
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On Thu, Jun 22, 2017 at 11:42:03AM +0800, Tao Wang wrote:
> Bind thermal sensor driver for Hi3660.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> ---
> Changes in v2:
> - rebase changes on linux next
> 
>  arch/arm64/boot/dts/hisilicon/hi3660.dtsi |    6 ++++++
>  1 file changed, 6 insertions(+)
> 
> diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
> index c6a1961..a6a1e01 100644
> --- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
> +++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
> @@ -848,5 +848,11 @@
>  				     &sdio_cfg_func>;
>  			status = "disabled";
>  		};
> +
> +		tsensor: tsensor {
> +			compatible = "hisilicon,hi3660-thermal";
> +			reg = <0x0 0xfff30000 0x0 0x1000>;
> +			#thermal-sensor-cells = <1>;
> +		};

Are you planning to also add thermal zone entries?

>  	};
>  };
> -- 
> 1.7.9.5
> 
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From: Tao Wang <kevin.wangtao@linaro.org>

This series adds thermal support for Hi3660 Soc, which support
all the hardware temperture sensors and two virtual sensors(one
for maximum value of all and one for average value of all).

Patch 1 add dt-binding document to describe how to config dt
for the driver.
Patch 2 introduces the thermal sensor driver.
Patch 3 add dts for the thermal senor driver on Hi3660.

hardware document can be found on
https://github.com/96boards/documentation/blob/master/ConsumerEdition/HiKey960/HardwareDocs/HiKey960_SoC_Reference_Manual.pdf

Changes in v2:
- correct alphabet order
- correct compatible name
- remove redundant property
- rebase changes on linux next

Changes in v3:
- remove unnecessary log print
- described all platform related parameters in DT
- make the driver forward compatible

Tao Wang (3):
  dt-bindings: Document the hi3660 thermal sensor bindings
  thermal: hisilicon: add thermal sensor driver for Hi3660
  arm64: dts: register Hi3660's thermal sensor

 .../devicetree/bindings/thermal/hisi-tsensor.txt   |  23 +++
 arch/arm64/boot/dts/hisilicon/hi3660.dtsi          |  10 +
 drivers/thermal/Kconfig                            |  13 ++
 drivers/thermal/Makefile                           |   1 +
 drivers/thermal/hisi_tsensor.c                     | 223 +++++++++++++++++++++
 include/dt-bindings/thermal/hi3660-thermal.h       |  30 +++
 6 files changed, 300 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
 create mode 100644 drivers/thermal/hisi_tsensor.c
 create mode 100644 include/dt-bindings/thermal/hi3660-thermal.h