| Message ID | 1385390669-7613-1-git-send-email-eduardo.valentin@ti.com |
|---|---|
| State | Accepted, archived |
| Headers | show |
Hello again Rui, On 25-11-2013 10:44, Eduardo Valentin wrote: > Hello Rui, > > Please consider the following changes for 3.14. It contains the work of > representing hardware thermal using device tree. It also contains > three examples on how to use the new representation on sensor devices, > using three different drivers to accomplish it. One driver is on thermal > subsystem, the TI SoC thermal, and the other two drivers are in hwmon > subsystem. I also included a change on cpu cooling device, which required > also a change on cpufreq-cpu0 driver. The change on this cooling device > still keeps in one piece its usage on different platforms. > > Because it is a controversial topic due to the lack of standards, and > because it touches different subsystems, it took way longer than I expected. > However, I've been discussing in different channels, and I believe I got > enough entropy now to go forward. We have acks from cpufreq folks (on ARM side) > and from hwmon folks too. Raphael W., Jean D. and Mark R. have also > reviewed this series. They agree with the core idea of the work. FYI, Mark R. also acked the work on device tree binding behalf. And after a couple of improvements on binding document suggested by Thomasz F. and Mark. R, I uploaded in the same branch the resulting series. Let me know if you have troubles pulling the series. > > It has been agreed that this is not the end of it. As I said I started > with only three examples, but there are other potential drivers to use > this API. So, I have agreed with Jean D., for instance, that this > series would be first step of the complete work. Next would be to check > other potential drivers to be converted and then validate the proposed > API. Currently the thermal framework would be polling for device > temperature, but we could implement a couple of call backs to setup > update rate, thresholds and hysteresis too, for instance. > > On the other hand, I don't think the principle and concept would break > after converting the remaining drivers. That is why I am sending this pull > request. > > Another point is, as you can see, there are several points in this pull > request that do not belong to thermal subsystem. It has been suggested > by Guenter R. that in such cases, it is recommended to send the complete > series via one single subsystem. Thus, I am sending via your queue. > > Lastly, I've also volunteered to maintain the upcoming thermal bindings. > Then, you can see I am adding thermal bindings to our MAINTAINERS entry too. > > > All best, > > The following changes since commit 86e0a0bdf81c2dfa2a5a258dbb52f49c40ebc197: > > Merge branches 'intel_powerclamp', 'tmon' and 'misc' of .git into next (2013-11-07 08:45:54 +0800) > > are available in the git repository at: > > > git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git next > > for you to fetch changes up to 14d653c8ffc85c4aea7e50baa9a3c198b4fcf9c5: > > MAINTAINERS: add thermal bindings entry in thermal domain (2013-11-25 10:19:12 -0400) > > ---------------------------------------------------------------- > Eduardo Valentin (20): > thermal: allow registering without .get_temp > thermal: introduce device tree parser > thermal: core: introduce thermal_of_cooling_device_register > thermal: cpu_cooling: introduce of_cpufreq_cooling_register > cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties > hwmon: lm75: expose to thermal fw via DT nodes > hwmon: tmp102: expose to thermal fw via DT nodes > thermal: ti-soc-thermal: use thermal DT infrastructure > arm: dts: add omap4 CPU thermal data > arm: dts: add omap4430 thermal data > arm: dts: add omap4460 thermal data > arm: dts: add cooling properties on omap4430 cpu node > arm: dts: add cooling properties on omap4460 cpu node > arm: dts: add omap5 GPU thermal data > arm: dts: add omap5 CORE thermal data > arm: dts: add omap5 thermal data > arm: dts: add cooling properties on omap5 cpu node > arm: dts: make OMAP443x bandgap node to belong to OCP > arm: dts: make OMAP4460 bandgap node to belong to OCP > MAINTAINERS: add thermal bindings entry in thermal domain > > .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 + > .../devicetree/bindings/thermal/thermal.txt | 589 ++++++++++++++ > MAINTAINERS | 1 + > arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 + > arch/arm/boot/dts/omap443x.dtsi | 23 +- > arch/arm/boot/dts/omap4460.dtsi | 29 +- > arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 + > arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 + > arch/arm/boot/dts/omap5.dtsi | 15 +- > drivers/cpufreq/Kconfig | 2 +- > drivers/cpufreq/cpufreq-cpu0.c | 16 + > drivers/hwmon/lm75.c | 35 +- > drivers/hwmon/tmp102.c | 19 + > drivers/thermal/Kconfig | 14 + > drivers/thermal/Makefile | 1 + > drivers/thermal/cpu_cooling.c | 56 +- > drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++ > drivers/thermal/thermal_core.c | 77 +- > drivers/thermal/thermal_core.h | 9 + > drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +- > include/dt-bindings/thermal/thermal.h | 17 + > include/linux/cpu_cooling.h | 25 + > include/linux/thermal.h | 32 +- > 23 files changed, 1939 insertions(+), 51 deletions(-) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt > create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi > create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi > create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi > create mode 100644 drivers/thermal/of-thermal.c > create mode 100644 include/dt-bindings/thermal/thermal.h > -- > To unsubscribe from this list: send the line "unsubscribe linux-pm" in > the body of a message to majordomo@vger.kernel.org > More majordomo info at http://vger.kernel.org/majordomo-info.html > >
Hello Rui, Please consider the following changes for 3.14. It contains the work of representing hardware thermal using device tree. It also contains three examples on how to use the new representation on sensor devices, using three different drivers to accomplish it. One driver is on thermal subsystem, the TI SoC thermal, and the other two drivers are in hwmon subsystem. I also included a change on cpu cooling device, which required also a change on cpufreq-cpu0 driver. The change on this cooling device still keeps in one piece its usage on different platforms. Because it is a controversial topic due to the lack of standards, and because it touches different subsystems, it took way longer than I expected. However, I've been discussing in different channels, and I believe I got enough entropy now to go forward. We have acks from cpufreq folks (on ARM side) and from hwmon folks too. Raphael W., Jean D. and Mark R. have also reviewed this series. They agree with the core idea of the work. It has been agreed that this is not the end of it. As I said I started with only three examples, but there are other potential drivers to use this API. So, I have agreed with Jean D., for instance, that this series would be first step of the complete work. Next would be to check other potential drivers to be converted and then validate the proposed API. Currently the thermal framework would be polling for device temperature, but we could implement a couple of call backs to setup update rate, thresholds and hysteresis too, for instance. On the other hand, I don't think the principle and concept would break after converting the remaining drivers. That is why I am sending this pull request. Another point is, as you can see, there are several points in this pull request that do not belong to thermal subsystem. It has been suggested by Guenter R. that in such cases, it is recommended to send the complete series via one single subsystem. Thus, I am sending via your queue. Lastly, I've also volunteered to maintain the upcoming thermal bindings. Then, you can see I am adding thermal bindings to our MAINTAINERS entry too. All best, The following changes since commit 86e0a0bdf81c2dfa2a5a258dbb52f49c40ebc197: Merge branches 'intel_powerclamp', 'tmon' and 'misc' of .git into next (2013-11-07 08:45:54 +0800) are available in the git repository at: git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git next for you to fetch changes up to 14d653c8ffc85c4aea7e50baa9a3c198b4fcf9c5: MAINTAINERS: add thermal bindings entry in thermal domain (2013-11-25 10:19:12 -0400) ---------------------------------------------------------------- Eduardo Valentin (20): thermal: allow registering without .get_temp thermal: introduce device tree parser thermal: core: introduce thermal_of_cooling_device_register thermal: cpu_cooling: introduce of_cpufreq_cooling_register cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties hwmon: lm75: expose to thermal fw via DT nodes hwmon: tmp102: expose to thermal fw via DT nodes thermal: ti-soc-thermal: use thermal DT infrastructure arm: dts: add omap4 CPU thermal data arm: dts: add omap4430 thermal data arm: dts: add omap4460 thermal data arm: dts: add cooling properties on omap4430 cpu node arm: dts: add cooling properties on omap4460 cpu node arm: dts: add omap5 GPU thermal data arm: dts: add omap5 CORE thermal data arm: dts: add omap5 thermal data arm: dts: add cooling properties on omap5 cpu node arm: dts: make OMAP443x bandgap node to belong to OCP arm: dts: make OMAP4460 bandgap node to belong to OCP MAINTAINERS: add thermal bindings entry in thermal domain .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 + .../devicetree/bindings/thermal/thermal.txt | 589 ++++++++++++++ MAINTAINERS | 1 + arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 + arch/arm/boot/dts/omap443x.dtsi | 23 +- arch/arm/boot/dts/omap4460.dtsi | 29 +- arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 + arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 + arch/arm/boot/dts/omap5.dtsi | 15 +- drivers/cpufreq/Kconfig | 2 +- drivers/cpufreq/cpufreq-cpu0.c | 16 + drivers/hwmon/lm75.c | 35 +- drivers/hwmon/tmp102.c | 19 + drivers/thermal/Kconfig | 14 + drivers/thermal/Makefile | 1 + drivers/thermal/cpu_cooling.c | 56 +- drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++ drivers/thermal/thermal_core.c | 77 +- drivers/thermal/thermal_core.h | 9 + drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +- include/dt-bindings/thermal/thermal.h | 17 + include/linux/cpu_cooling.h | 25 + include/linux/thermal.h | 32 +- 23 files changed, 1939 insertions(+), 51 deletions(-) create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi create mode 100644 drivers/thermal/of-thermal.c create mode 100644 include/dt-bindings/thermal/thermal.h -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html