| Message ID | 20120720205137.84E3D290043B@tardy |
|---|---|
| State | Accepted, archived |
| Delegated to: | David Miller |
| Headers | show |
On 20/07/2012 22:51, Rick Jones wrote: > - Discussions regarding the developpement of the bonding driver take place > + Discussions regarding the development of the bonding driver take place Thanks for catching my typo :-) Reviewed-by: Nicolas de Pesloüan <nicolas.2p.debian@free.fr> -- To unsubscribe from this list: send the line "unsubscribe netdev" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
Rick Jones <raj@tardy.cup.hp.com> wrote: >From: Rick Jones <rick.jones2@hp.com> > >The section titled "Configuring Bonding for Maximum Throughput" is >actually section twelve not thirteen, and there are a couple of words >spelled incorrectly. > >Signed-off-by: Rick Jones <rick.jones2@hp.com> Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> -J --- -Jay Vosburgh, IBM Linux Technology Center, fubar@us.ibm.com -- To unsubscribe from this list: send the line "unsubscribe netdev" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
From: Jay Vosburgh <fubar@us.ibm.com> Date: Fri, 20 Jul 2012 17:08:28 -0700 > Rick Jones <raj@tardy.cup.hp.com> wrote: > >>From: Rick Jones <rick.jones2@hp.com> >> >>The section titled "Configuring Bonding for Maximum Throughput" is >>actually section twelve not thirteen, and there are a couple of words >>spelled incorrectly. >> >>Signed-off-by: Rick Jones <rick.jones2@hp.com> > > Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Applied, thanks everyone. -- To unsubscribe from this list: send the line "unsubscribe netdev" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
diff --git a/Documentation/networking/bonding.txt b/Documentation/networking/bonding.txt index bfea8a3..6b1c711 100644 --- a/Documentation/networking/bonding.txt +++ b/Documentation/networking/bonding.txt @@ -1210,7 +1210,7 @@ options, you may wish to use the "max_bonds" module parameter, documented above. To create multiple bonding devices with differing options, it is -preferrable to use bonding parameters exported by sysfs, documented in the +preferable to use bonding parameters exported by sysfs, documented in the section below. For versions of bonding without sysfs support, the only means to @@ -1950,7 +1950,7 @@ access to fail over to. Additionally, the bonding load balance modes support link monitoring of their members, so if individual links fail, the load will be rebalanced across the remaining devices. - See Section 13, "Configuring Bonding for Maximum Throughput" + See Section 12, "Configuring Bonding for Maximum Throughput" for information on configuring bonding with one peer device. 11.2 High Availability in a Multiple Switch Topology @@ -2620,7 +2620,7 @@ be found at: https://lists.sourceforge.net/lists/listinfo/bonding-devel - Discussions regarding the developpement of the bonding driver take place + Discussions regarding the development of the bonding driver take place on the main Linux network mailing list, hosted at vger.kernel.org. The list address is: