[v2,1/4] dt-bindings: thermal: k3: Add VTM bindings documentation
diff mbox series

Message ID 20200214063443.23589-2-j-keerthy@ti.com
State Changes Requested
Headers show
Series
  • thermal: k3: Add support for bandgap sensors
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Commit Message

Keerthy Feb. 14, 2020, 6:34 a.m. UTC
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Signed-off-by: Keerthy <j-keerthy@ti.com>
---

Changes in v2:

  * Fixed make dt_binding_check errors.

 .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
 1 file changed, 57 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml

Comments

Rob Herring Feb. 18, 2020, 8:20 p.m. UTC | #1
On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 AM654 supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
> 
> Signed-off-by: Keerthy <j-keerthy@ti.com>
> ---
> 
> Changes in v2:
> 
>   * Fixed make dt_binding_check errors.
> 
>  .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>  1 file changed, 57 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
> 

My bot found errors running 'make dt_binding_check' on your patch:

Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
FATAL ERROR: Unable to parse input tree
scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
Makefile:1263: recipe for target 'dt_binding_check' failed
make: *** [dt_binding_check] Error 2

See https://patchwork.ozlabs.org/patch/1237882
Please check and re-submit.
Keerthy Feb. 19, 2020, 7:40 a.m. UTC | #2
On 19/02/20 1:50 am, Rob Herring wrote:
> On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote:
>> Add VTM bindings documentation. In the Voltage Thermal
>> Management Module(VTM), K3 AM654 supplies a voltage
>> reference and a temperature sensor feature that are gathered in the band
>> gap voltage and temperature sensor (VBGAPTS) module. The band
>> gap provides current and voltage reference for its internal
>> circuits and other analog IP blocks. The analog-to-digital
>> converter (ADC) produces an output value that is proportional
>> to the silicon temperature.
>>
>> Signed-off-by: Keerthy <j-keerthy@ti.com>
>> ---
>>
>> Changes in v2:
>>
>>    * Fixed make dt_binding_check errors.
>>
>>   .../bindings/thermal/ti,am654-thermal.yaml    | 57 +++++++++++++++++++
>>   1 file changed, 57 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
>>
> 
> My bot found errors running 'make dt_binding_check' on your patch:
> 
> Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node
> Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error
> FATAL ERROR: Unable to parse input tree
> scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed
> make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1
> Makefile:1263: recipe for target 'dt_binding_check' failed
> make: *** [dt_binding_check] Error 2
> 
> See https://patchwork.ozlabs.org/patch/1237882
> Please check and re-submit.

Rob,

I am using:

Tree: https//github.com/devicetree-org/dt-schema.git
branch: master

I have make dt_binding_check working for 
Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml

Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts
is created without any errors :

https://pastebin.ubuntu.com/p/6MkMbKPpbY/

I did not see any errors as the other files erred out.

Today i tried with DT_SCHEMA_FILES option and then finally reproduced 
the errors. It is a bit confusing for the first time users.

Now i have it compiled without any errors.

Posting v3 in a bit.

- Keerthy


>

Patch
diff mbox series

diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
new file mode 100644
index 000000000000..1c26ad8cd505
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
@@ -0,0 +1,57 @@ 
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Texas Instruments AM654 VTM (DTS) binding
+
+maintainers:
+  - Keerthy <j-keerthy@ti.com>
+
+properties:
+  compatible:
+    const: ti,am654-vtm
+
+  reg:
+    maxItems: 1
+
+  power-domains:
+    maxItems: 1
+    description: phandle to the associated power domain
+
+  "#thermal-sensor-cells":
+    const: 1
+
+required:
+  - "#thermal-sensor-cells"
+  - compatible
+  - reg
+  - power-domains
+
+additionalProperties: false
+
+examples:
+  - |
+
+    vtm: wkup_vtm0@42050000 {
+        compatible = "ti,am654-vtm";
+        reg = <0x0 0x42050000 0x0 0x25c>;
+        power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
+        #thermal-sensor-cells = <1>;
+    };
+
+    mpu0_thermal: mpu0_thermal {
+        polling-delay-passive = <250>; /* milliseconds */
+        polling-delay = <500>; /* milliseconds */
+        thermal-sensors = <&wkup_vtm0 0>;
+
+        trips {
+                mpu0_crit: mpu0_crit {
+                        temperature = <125000>; /* milliCelsius */
+                        hysteresis = <2000>; /* milliCelsius */
+                        type = "critical";
+                };
+        };
+    };
+...